Enriching lives through innovation Advanced Materials Protection, safety and sustainability

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Rely on us with confidence For more than 60 years, as a global provider, Huntsman Advanced Materials, has developed innovative solutions that are used during virtually every stage in the production of printed circuit boards and electronic devices. Our know-how and expertise allow us to develop a wide range of solutions that answer the most stringent requirements for electronics applications: > high thermal resistance and thermal conductivity > ame-retardancy (UL94 V0/HB listing, Railway NF16/101-102 fl and EN/TS 45545 qualifications) > excellent mechanical and dielectric properties > variable...

Protection, safety and sustainability Thermosets such as epoxies and polyurethanes are widely used in the electronics industry to protect devices against chemical, mechanical and electrical loads. Advantages Thermosets over thermoplastics Epoxy encapsulants Polyurethane encapsulants > imensional accuracy and D stability > xcellent property retention E over a broad range of temperatures > olvent resistance S > on-melting, flameN retardant & low-smoke density > reep resistant C > mbient and hot curing A systems > Long pot life, latency > Excellent cross linking > Excellent impregnation > igh voltage...

Epoxy and polyurethane encapsulants Epoxy resins are proven for long-term thermal endurance, especially for applications at higher temperatures. Polyurethane systems are also available, offering thermal endurance profiles above 100°C and flexibility at low temperatures. Temperature is very often the dominating ageing factor on insulating materials and is by far the most common stress applied to electronic devices. The ability of parts to withstand cyclical exposures to extremely high and low temperatures is correlated to the thermal endurance profile of the encapsulant. The selection of the appropriate...

Testing, supporting and training services Material testing and characterisation Mechanical testings Tensile, compressive, flexural properties, shore hardness, thermal ageing, cycling under humidity, compressive & flexural properties, HDT, UV-ageing under temperature & humidity, Charpy / Izod pendulum impact testing, tensile shear / peeling, ILSS, creep testing. Electrical testings Dielectric strength, dissipation factor, permittivity, inductance / capacitance, resistivity, tracking resistance CTI, electrolytic corrosion, moisture insulation resistance, thermal shock storage, thermal ageing, UV...

Application technologies Why using this process ? Process 1- 4 = Encapsulation I Process 5    = Impregnation I Process 7 = Bonding -6 Which criteria need to be considered for the selection of a resin system ? What are the typical applications ? Excellent impregnation and gap filling capability Low viscosity for easy processing High crack resistance Low coefficient of thermal expansion High thermal durability (thermal class) High dielectric strength High heat conductivity Sedimentation stability Supply in bulk container Car ignition coils Motor bike ignition coils Transformers Stators / Rotors...

Ignition coils

Flammability Benefits Class UL 94, HB Short curing time. Optimal impregnation. UL 94, HB Mineral filled resin with very good impregnation capability. UL 94, HB Optimally filled toughened casting resin system with good impregnation capability for processing at high temperature. UL 94, HB Mineral filled resin with very high performance. UL 94, HB Low viscosity, optimally filled casting system for processing and curing at high temperature. Unfilled resin system with good dielectric and thermal shock resistance. UL 94, HB System with very good impregnation capability. Excellent thermal shock resistance....

Trickle impregnation or VPI Vacuum casting Impregnation Curing capability conditions Conditions Norm Glass transition temperature (Tg) Coefficient of thermal expansion (CTE) DSC Casting / Potting Process Pumps Product designation Automotive Applications Power tools Electric motors Below Tg / Above Tg ISO 11357-2 Thermal class Thermal conductivity 25°C IEC 60085 ISO 8894-1 hot / cold °C 10-6 K-1 o hot 175 25 / 65 H 3.00 Unit W/mK • • • • • + hot 120 24 / 67 H 1.50 Araldite® CW 1312 / Aradur® HY 1300 • • • ++ cold 30 103 B 1.10 Araldite® CW 1302 / Aradur® HY 1300 • • • + cold 75 42 / 105 H 0.88...

Flammability Benefits Class UL 94, V-0 (12 mm) Very high thermal conductivity. Good thermal resistance. Good resistance to atmospheric and chemical degradation. Stable at room temperature. Monocomponent. UL 94, V-0 (12 mm) High thermal conductivity. UL 94, V-0 (3,2 mm) Resilient casting system exhibiting good resistance to thermal ageing and good thermal shock resistance. UL 94, V-0 (3 mm), HB NF 16-101/102, I2F1/4 Excellent thermal endurance. Recommended for electrical devices working in potentially explosive environments. Thermal Index (TI) of 181°C. UL 94, V-1 (12 mm), HB (4 mm), NF 16-101/102,...

Assemblies Casting / Potting Vacuum casting Process Wire harness / Connectors Proximity switches Modules / Sensors Applications Inverters / Converters Product designation Curing conditions Conditions Glass transition temperature (Tg) Thermal class DSC Norm ISO 11357-2 Unit Hardness 23°C IEC 60085 DIN 53505 hot / cold • • Araldite® XW 1155-1 / Aradur® HY 1473 °C Shore D / Shore A cold 58 B n.a. • Araldite® DBF / Aradur® HY 2966 • • cold 54 E D80 • • hot 30 F D70 • • cold 20 B D40 / A85 • • cold 8 E D20 / A70 • • cold -9 F D29 / A85 • n.a. -35 F D28 / A86 • cold -62 B D20 / A70 Araldite® CW 5730N...

Flammability Benefits Class UL 94 HBF (6 mm) Filled expandable EP casting system. Good thermal shock resistance. Excellent electrical properties. Low viscosity. Unfilled EP resin. Good heat resistance. Good resistance to atmospheric and chemical degradation. UL 94 V-0 (6 mm) Flexible impregnation EP system. UL 94 V-0 (6 mm) Flexible multipurpose PU system. Excellent flow properties.Thermal Index (TI) of 152°C. Very flexible EP system with good thermal ageing stability. Long pot life. UL V-0 (6 mm) Low viscosity and high thermal conductivity. Good flowability. For encapsulation of (solar) electric...