TRSYS01

TRSYS01

Product catalog summary
Introduction
The document discusses the in-situ measurement of thermal resistance, thermal transmittance, or U-Values in building studies. The measurement of thermal resistance (TR) involves the simultaneous measurement of time-averaged heat flux (Φ) using a heat flux sensor and differential temperature (∆T) using two temperature sensors. The formula used is TR = ∆T / Φ. The method's applicability, installation, and data analysis are guided by ISO and ASTM standards.

TRSYS01 Specifications
The TRSYS01 system is designed for high-accuracy thermal resistance measurement, adhering to ISO 9869 and ASTM C1155/C1046 standards. It includes:
  • Measurement locations: 2 (expandable on request)
  • Power requirements: 110-220 V, 0.5 Watt (max)
  • Differential temperature accuracy: 0.1 degree C
  • Heat flux sensor: Type HFP01
  • Protection: IP 63
  • Cable length: 20 m (3x) and 10 m (3x)
  • Storage capacity: Over 30 days of data with 10-minute and 24-hour averages
  • Data analysis: User-performed according to ISO and ASTM standards

Options
Additional options include an LP02 solar radiation sensor and an integrated battery pack.

System Components
The TRSYS01 system comprises an MCU Measurement and Control Unit, an adapter for power, two pairs of matched thermocouples, and two heat flux plates of type HFP01. Data is measured and stored by the MCU, with readout performed via a temporary PC connection. Software for data readout is included.
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Catalog excerpts

TRSYS01-1

TRSYS01 HIGH ACCURACY THERMAL RESISTANCE MEASUREMENT SYSTEM WITH 2 MEASUREMENT LOCATIONS TRSYS01 is a measurement system for analysis of thermal resistance and thermal transmittance of building elements by in-situ measurement. It can be used for measurements according to ISO 9869 and ASTM C1155 / C1046 standards. In its standard configuration the system is equipped with two heat flux sensors as well as two pairs of matched thermocouples for differential temperature measurements. Figure 1 TRSYS01 consists of MCU Measurement and Control Unit (1), an adapter for power (2), 2 pairs of matched thermocouples (4), and 2 heat flux plates of type HFP01 (5). MCU measures and stores data. Readout is performed by connecting temporarily to a PC (3) (not included). Software for readout is included. INTRODUCTION The in-situ measurement of thermal resistance, thermal transmittance or U-Values of buildings is often applied in studies of building elements. The thermal resistance, TR, measurement is based on simultaneous measurement of time averaged heat flux Φ (using a heat flux sensor) and differential temperature, ∆T, (two temperature sensors). The ISO and ASTM standards on the subject comment on applicability of the method, on installation and on data analysis. The TRSYS consists of high accuracy electronics (measurement accuracy up to 1 microvolt) as well as matched thermocouple pairs to make a differential temperature measurement with a total accuracy of better than 0.1 degrees C. It also includes HFP01 heat flux plates. HFP01 is the world’s most popular sensor for heat flux measurement through building envelopes. Test method: Measurement locations: Power requirements: Differential temperature (∆T) : Heat flux sensor: Protection sensors and MCU: Cable length: Storage capacity: Data analysis: ISO 9869 and ASTM C1155 / C1046 2 (can be increased on request) 110-220 V, 0.5 Watt (max) matched pairs thermocouple type KX, 584.3:1989 0.1 degree C type HFP01 IP 63 20 m (3x) and 10 m (3x) > 30 days of data: 10 minute and 24 hour averages to be performed by the user according to ISO and ASTM standards OPTIONS LP02 solar radiation sensor Integrated battery pack Version 0620 (page 1 of 1) Hukseflux reserve the right to alter specifications without prior notice HUKSEFLUX™ THERMAL SENSORS . WWW.HUKSEFLUX.COM . [email protected]

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.