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HORIBA STEC
Group: Horiba
Catalog excerpts
Back side wafer cooling system
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The GR-300 series helps manage the positioning of the wafer in the electrostatic chuck by controlling the back pressure of He or Ar on the underside of the wafer. This product is suitable for controlling pressure in cooling systems using conductive gases which are Helium and Argon. System configuration example When using GR-300 for back side wafer cooling, accurate pressure control of helium gas for both the wafer center and wafer edge is possible. Moreover, the gas flow can be monitored accurately with the integrated mass flow sensor. Product specifications •Pressure control with high...
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