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HORIBA STEC
GR-300, Pressure controller with flow meter

GR-300, Pressure controller with flow meter

Product catalog summary

Overview: The GR-300 series is designed for managing wafer positioning in electrostatic chucks by controlling the back pressure of Helium (He) or Argon (Ar) gases. It is suitable for cooling systems using these conductive gases.

Features:

Accurate Pressure Control: The system allows precise control of helium gas pressure at both the wafer center and edge, utilizing a high precision piezo valve and a pressure sensor with accuracy within <1% F.S.
Mass Flow Sensor: An optional mass flow sensor enables minute differential pressure control and gas flow monitoring for self-diagnostic capabilities.
RoHS Compliance: The product is environmentally friendly, adhering to the latest RoHS regulations.

Specifications:

Pressure Control: High stability and accuracy with a piezo valve.
Operating Temperature: 5℃ to 50℃, with a recommended range of 15℃ to 40℃.
Response Time: 1 second or less under adjustment conditions.
Maximum Primary Pressure: 250kPa(A).
Pressure Resistance: 300kPa(A).
Leak Integrity: 5×10^-12Pa･m³/sec.
Gas Compatibility: He, Ar, N2.
Flow Accuracy: ±1.0% S.P. for flow rates >25% F.S., ±0.25% F.S. for flow rates ≤25% F.S.

System Configuration: The system includes external dimensions and product specifications, with options for digital interfaces like RS485 F-Net and DeviceNet™ Protocol.

Contact Information: The document provides contact details for HORIBA offices worldwide, including locations in Japan, Taiwan, Korea, China, Singapore, USA, UK, France, Netherlands, and Germany.

Additional Notes: Users are advised to read the operation manual for safe handling. The catalog content is subject to change without notice, and copying is prohibited.

Catalog excerpts

GR-300, Pressure controller with flow meter-1

Back side wafer cooling system

Open the catalog to page 1

GR-300, Pressure controller with flow meter-2

The GR-300 series helps manage the positioning of the wafer in the electrostatic chuck by controlling the back pressure of He or Ar on the underside of the wafer. This product is suitable for controlling pressure in cooling systems using conductive gases which are Helium and Argon. System configuration example When using GR-300 for back side wafer cooling, accurate pressure control of helium gas for both the wafer center and wafer edge is possible. Moreover, the gas flow can be monitored accurately with the integrated mass flow sensor. Product specifications •Pressure control with high stability...

Open the catalog to page 2

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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