Catalogue Wafer Aligner
28Pages

Wafer Aligner

HIWIN GmbH Brucklesbund 1 77654 Offenburg Deutschland Fon +49 781 93278-0 info@hiwin.de hiwin.de All rights reserved. Complete or partial reproduction is not permitted without our permission. Note: The technical data in this catalogue may be changed without prior notice.

Wafer Aligner Wafer Aligner Exact positioning of wafers is the prerequisite for error-free production processes in the semiconductor industry. With the Wafer Aligner HPA, transparent, translucent and opaque wafers are reliably aligned for the respective process in just a few seconds. Aligners that place the wafers using the standard, warpage or edge contact processes are available. Three independently moving HIWIN axes with spindle drive for centring and angular alignment operate with an absolute precision of ±0.1 mm. Due to its compact design, the HPA series is ideal for integration into...

Wafer Aligner Contents

Wafer Aligner Product overview

Wafer Aligner { { { { { Three-axis wafer aligner All-in-one design with integrated controller 4 different wafer handling methods Wafer diameters from 2 inches to 12 inches For transparent, translucent and opaque objects

Wafer Aligner General information 2. General information 2.1 Features Compact in design, the Wafer Aligner HPA from HIWIN balances wafers reliable. Within a few seconds, three HIWIN ballscrew stages work together to center the wafer and align the notch with an accuracy of ±0.1 mm and an angular accuracy of ±0.2°. With its all-in-one design, the HPA series is extremely compact and therefore suitable for the neatless integration into sophisticated system concepts. Thanks to its RS232 interface, the Prealigner can be integrated into existing control systems seamlessly. Wafer diameters from 2...

2.3 Model overview Contact type HPA26 Wafer Size Moving axis Standard (Vacuum Chuck) Transparent, Translucent, Opaque Notch, Flat Side Warpage (Vacuum Pins)

Wafer Aligner Specifications and Dimensions – HPA Series 3. Specifications and Dimensions – HPA Series 3.1 Specifications and Dimensions – HPA26 3.1.1 Specifications – HPA26 Item Model Number Wafer Size Wafer Material Transparent, Translucent, Opaque 1) Wafer Features Flat / Notch (SEMI Standard) Wafer Thickness Wafer Warpage Number of Motion Axis Wafer Handling Method Vacuum Suction (Chuck) Wafer Contact Material Anti-static silicone rubber Working Range Allowable Wafer Offset Notch Angle Communication Protocol Cleanliness Level Power Supply Tube size Ambient Temperature Ambient Humidity

Power RS232 Warning Alarm

Wafer Aligner Specifications and Dimensions – HPA Series 3.2 Specifications and Dimensions – HPA48 3.2.1 Specifications – HPA48 Item Model Number Wafer Size Wafer Material Transparent, Translucent, Opaque 1) Wafer Features Flat / Notch (SEMI Standard) Wafer Thickness Wafer Warpage Number of Motion Axis Wafer Handling Method Vacuum Suction (Chuck) Wafer Contact Material Working Range Allowable Wafer Offset Notch Angle Communication Protocol Cleanliness Level Power Supply Tube size Ambient Temperature Ambient Humidity

Power RS232 Warning Alarm B 97.9 (8" wafer MCP) 122.9 (6" wafer MCP) 135.4 (5" wafer MCP)

Wafer Aligner Specifications and Dimensions – HPA Series 3.3 Specifications and Dimensions – HPA812 3.3.1 Specifications – HPA812 Item Model Number Wafer Size Wafer Material Transparent, Translucent, Opaque 1) Wafer Features Flat / Notch (SEMI Standard) Wafer Thickness Wafer Warpage Number of Motion Axis Wafer Handling Method Vacuum Suction (Chuck) Wafer Contact Material Working Range Allowable Wafer Offset Notch Angle Communication Protocol Cleanliness Level Power Supply Tube size Voltage Current Ambient Temperature Ambient Humidity

Power RS232 Warning Alarm

Wafer Aligner Specifications and Dimensions – HPA Series 3.4 Specifications and Dimensions – HPA48-W 3.4.1 Specifications – HPA48-W Item Model Number Wafer Size Wafer Material Transparent, Translucent, Opaque 1) Wafer Features Flat / Notch (SEMI Standard) Wafer Thickness Wafer Warpage Number of Motion Axis Wafer Handling Method Vacuum Suction (Chuck) Wafer Contact Material Anti-static silicone rubber Working Range Allowable Wafer Offset Notch Angle Communication Protocol Cleanliness Level Power Supply Tube size Voltage Current Ambient Temperature Ambient Humidity

Power RS232 Warning Alarm

Wafer Aligner Specifications and Dimensions – HPA Series 3.5 Specifications and Dimensions – HPA812-W 3.5.1 Specifications – HPA812-W Item Model Number Wafer Size Wafer Material Transparent, Translucent, Opaque 1) Wafer Features Flat / Notch (SEMI Standard) Wafer Thickness Wafer Warpage Number of Motion Axis Wafer Handling Method Vacuum Suction (Chuck) Wafer Contact Material Anti-static silicone rubber Working Range Allowable Wafer Offset Notch Angle Communication Protocol Cleanliness Level Power Supply Tube size Voltage Current Ambient Temperature Ambient Humidity

Power RS232 Warning Alarm

Wafer Aligner Specifications and Dimensions – HPA Series 3.6 Specifications and Dimensions – HPA8-E 3.6.1 Specifications – HPA8-E Item Model Number Wafer Size Wafer Material Transparent, Translucent, Opaque 1) Wafer Features Notch (SEMI Standard) Wafer Thickness Wafer Warpage Number of Motion Axis Wafer Handling Method Edge Contact Wafer Contact Material Anti-static silicone rubber Working Range Allowable Wafer Offset Notch Angle Communication Protocol Cleanliness Level Power Supply Ambient Temperature Ambient Humidity

Power RS232 Warning Alarm

Wafer Aligner Specifications and Dimensions – HPA Series 3.7 Specifications and Dimensions – HPA12-E 3.7.1 Specifications – HPA12-E Item Model Number Wafer Size Wafer Material Transparent, Translucent, Opaque 1) Wafer Features Notch (SEMI Standard) Wafer Thickness Wafer Warpage Number of Motion Axis Wafer Handling Method Edge Contact Wafer Contact Material Anti-static silicone rubber Working Range Allowable Wafer Offset Notch Angle Communication Protocol Cleanliness Level Power Supply Ambient Temperature Ambient Humidity