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Micro Packaging: 3D Molded Interconnect Devices - 3D MID

Micro Packaging: 3D Molded Interconnect Devices - 3D MID

Product catalog summary

Overview of 3D Molded Interconnect Devices (3D MID)
3D Molded Interconnect Devices (3D MID) by HARTING AG Mitronics represent a cutting-edge technology for creating advanced multifunctional packages. HARTING Mitronics offers a comprehensive service from feasibility studies to volume production, ensuring a streamlined process for customers.

Services Offered by HARTING Mitronics

Concept and layout support
Tooling and sampling
Qualification processes
Volume production

Benefits of 3D MID

Enhanced functionality with reduced space consumption
High precision in 3D placement of sensor chips
Flexible design options
Reduced number of interfaces, minimizing assembly complexity and improving reliability
Integrated peripherals allow for additional functionalities such as antennas and reflectors

Micro Packaging by HARTING Mitronics
HARTING Mitronics provides a complete value chain from feasibility to production, offering a broad technology portfolio to select the best MID solution for specific applications. As a one-stop-shop, they minimize the number of logistic interfaces for customers.

Catalog excerpts

Micro Packaging: 3D Molded Interconnect Devices - 3D MID-1

Pushing Performance H ARTING 3D Molded Interconnect Devices - 3D MID

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Micro Packaging: 3D Molded Interconnect Devices - 3D MID-2

3D Molded Interconnect Devices (3D MID) by HARTING AG Mitronics Micro Packaging by HARTING Mitronics • 3D MID is the enabling technology for advanced multifunctional packages. • HARTING Mitronics provides the complete value chain from feasibility study to volume production. • A broad technology portfolio allows to select the best suited MID-solution for specific applications. • As a One-Stop-Shop HARTING Mitronics minimizes its customer's number of logistic Services by HARTING Mitronics • Support for concept and layout • Volume production • Increased functionality at reduced consumption • High...

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