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Pushing Performance H ARTING 3D Molded Interconnect Devices - 3D MID
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3D Molded Interconnect Devices (3D MID) by HARTING AG Mitronics Micro Packaging by HARTING Mitronics • 3D MID is the enabling technology for advanced multifunctional packages. • HARTING Mitronics provides the complete value chain from feasibility study to volume production. • A broad technology portfolio allows to select the best suited MID-solution for specific applications. • As a One-Stop-Shop HARTING Mitronics minimizes its customer's number of logistic Services by HARTING Mitronics • Support for concept and layout • Volume production • Increased functionality at reduced consumption •...
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