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Thermal Emission Microscope THEMOS Series

Thermal Emission Microscope THEMOS Series
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Thermal Emission Microscope THEMOS Series - 1

Thermal Emission Microscope R series

Thermal Emission Microscope THEMOS Series - 2

Thermal Emission Microscope The THEMOS series thermal emission microscope is a semiconductor failure analysis system that pinpoints failures by detecting thermal emissions generated within the semiconductor device. The increasing trend toward hyperfine patterns and lower supply voltages in semiconductor devices makes the infrared rays emitted by heat generated from semiconductor failure points fainter and more difficult to detect. The THEMOS series, which incorporates a high-sensitivity InSb camera, has a flexible product lineup from a simple stand model to an advanced system with an IR...

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Thermal Emission Microscope THEMOS Series - 3

Thermal Emission Microscope THEMQS Series Thermal lock-in measurement Thermal lock-in measurement The lock-in measurement method deducts noise by synchronizing the timing of power supply to a device and image capture. With this method, a thermal lock-in unit can provide high quality images even for low voltage devices. Acquired images Phase image Possible to localize a heat source by visualizing heat timing from phase images. Amplitude image High S/N is achieved by acquiring signals at a specific frequency and eliminating signals at other frequencies as noise. ▲ Objective lens: 15x, Bias:...

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Thermal Emission Microscope THEMOS Series - 4

Thermal Emission Microscope Series Thermal lock-in measurement Measurement examples Case study: Package device observation Microprocessor Chip size: 30 mm × 30 mm Case study: Defect layer observation by opening a side of a device Made a small opening at a side of mold to see a Si die. Superimposed the thermal image on an X-ray image Side open area Lock-in phase image at the opening area Measurement data 0.8× IR objective lens, 5 V, 1 Hz Measurement data 4× IR objective lens Case study: CMOS observation Found a defect under a bump Frontside observation Backside observation FIB cross section...

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Thermal Emission Microscope THEMOS Series - 5

Thermal Emission Microscope THEMOS Series Flexible system structure THEMOS mini System configurations *1 : The systems are special order products. *2 : The lens for macro observation *3 : Please ask Hamamatsu for more details. *4 : In the case of integrating 0.29x objective lens *1 : The systems are special order products.

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Thermal Emission Microscope THEMOS Series - 6

Thermal Emission Microscope Series Overview of function 3D-IC measurement function A12319 Possible to detect a heat point and its point of origin within stacked IC layers by using phase images taken by lock-in measurement and calculating them with thermal property information of each layer. If a layer's material information is unknown, it is possible to obtain the information by using a pulse heater. Even with the obtained material information, depth can be measured within a few % error. Principle Device Phase Heat point 1 Heat point 1 Heat point 2 Phase shift IR-ray Heat source Heat point...

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Thermal Emission Microscope THEMOS Series - 7

Thermal Emission Microscope THEMQS Series IR confocal laser scan microscope Newly developed 0.29x IR lens provides a clear wide view image without a narcissus phenomenon and View size comparison THEMOS-1000 provides high resolution pattern images by ntegrating an IR confocal laser scan microscope. By overlaying a laser pattern image on a thermal image, heat point can be localized accurately. ' Can't use 2 lasers of the same wavelength. IR-OBIRCH analysis function A8755 Adding the OBIRCH function for failure analysis allows pinpointing current leakage paths and defective interconnections in...

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Thermal Emission Microscope THEMOS Series - 8

Thermal Emission Microscope THEMOS Series Overview of function/Specifications Camera selection for photoemission observation A full lineup of optional cameras that detect faint photoemission from visible to near nfrared light is available. Dual stage mage acquisition (photoemission and thermal emission) without changing sample setting. It saves you time and lab space. Marking the vicinity of a localized failure point or four points around the failure point makes it easy to transfer position information on that failure point to other analysis equipment. Dimensions/Weight (Including option)...

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