œ Short-circuit of metalization œ Abnormality of contact holes œ Microplasma leakage in oxide layer œ Oxide layer breakdown œ TFT leakage / Organic EL leakage location detection œ Observation of temperature abnormalities in devices during the development of new semiconductor devices œ Temperature mapping of semiconductor materials and PC board FEATURES Thermal Emission Microscope THEMOS mini R InSb camera with superior sensitivity in the true thermal emission range of 3.7 ìm to 5.2 ìm is provided as the detector. InSb cameras have higher quantum efficiency for true thermal emission compared to alternative detectors. 200 mm wafer chuck as standard Clamps wafer sizes to a maximum of 200 mm. Also allows manual probing by manipulators. High sensitivity thermal detector (InSb) used Optimally designed IR optics New IR optical design is optimized for thermal analysis. In combination with the new detector, this design provides greater thermal detection capabilities than ever before. Lenses feature high N.A. and are incorporated into a lens turret. Long working distance allows easy probing of devices, dies and wafers. 100 90 80 70 60 50 40 30 20 10 0 3200 3700 4200 4700 5200 5700 Wavelength (nm) InSb camera spectral sensitivity Quantum efficiency (%) InSb The thermal emissions detector easily images through silicon at wavelengths from 3.7 ìm to 5.2 ìm, minimizing the need for special preparations to carry out backside analysis. Analysis of thermal emissions image through the backside MAIN APPLICATIONS Si substrate Pattern being measured Plastic mold Lead frame Cut Hot spot Bias Back side (mirror polishing) Thermal emissions Analysis of thermal emissions image through the backside THEMOS mini is thermal emission microscope with a high-sensitivity InSb camera that detects internal heat emissions from a semiconductor device. By displaying the detected thermal image superimposed onto the pattern image, THEMOS mini quickly indicates failures in the semiconductor device with high positional accuracy. Space-saving model ideal for non-destructive thermal emission analysis!

Cat. No. SSMS0025E03 OCT/2009 HPK Created in Japan .. mini Thermal Emission Microscope œ 200 mm manual chuck Wafers sizes Probing method Probe head platen Chuck travel To a maximum of 200 mm Vacuum held manipulator (sold separately) Fixed type Manual œ Microlens MWIR 30× œ Thermal lock-in function (C10565-01) This lens delivers a long working distance of 13 mm and good brightness of N.A.=0.71. High spatial resolution allows pinpointing of thermal emission locations. Combining with a thermal lock-in unit allows for lock-in analysis. This function suppresses thermal diffusion and cancels out external...