SIP plastic package The S8385/S8729 series is a family of large area Si PIN photodiodes molded into a miniature plastic SIP package (75% smaller in cubic volume than conventional types). Also available are lead forming types that save space when mounted on a PC board. Small plastic package: 4 × 4.8 × 1.8 t mm Barcode scanners 2-pin SIP lead type (lead length: 4.9 mm) High sensitivity, high-speed response Optical switches 2 types of spectral response characteristics available S8385, S8729, S8729-10: for visible to infrared range (λ=320 to 1100 nm) S8729-04: for infrared (λ=760 to 1100 nm) Lead forming type also available (S8729-10) Photosensitive area Structure / Absolute maximum ratings Dimensional outline Effective Photosensitive photosensitive area size area (mm) 2×2 Absolute maximum ratings Power Operating Storage dissipation temperature temperature P Topr Tstg (mW) (°C) (°C) 50 Note) xceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the E product within the absolute maximum ratings. Electrical and optical characteristics Spectral Peak response sensitivity range wavelength λ λp (nm) 320 to 1100 320 to 1100 760 to 1100 320 to 1100 Short circuit current Isc 100 lx (µA) 4.2 7.5 5 7.5 Cutoff frequency Dark current Temperature Terminal fc ID coefficient of VR=5 V capacitance NEP VR=5 V Ct ID λ=780 nm λ=λp VR=5 V TCID RL=50 Ω f=1 MHz Typ. Max. -3 dB (nA) (nA) (times/°C) (MHz) (pF) (W/Hz1/2) 0.1 1.0 12 1.0 × 10-14 1.1 × 10-14 1.15 25 0.2 2.0 16 1.2 × 10-14 1.1 × 10-
Open the catalog to page 1Spectral response Dark current vs. reverse voltage (Typ. Ta=25 °C) Dark current 0.2 erminal capacitance vs. reverse voltage Terminal capacitance vs. reverse voltage (Typ. Ta=25 °C, f=1 MHz) Terminal capacitance
Open the catalog to page 2Dimensional outline Relative sensitivity Dimensional outlines (unit: mm) S8385, S8729, S8729-04 Photosensitive area a Photosensitive surface Tolerance unless otherwise noted: ±0.1, ±2° Chip position accuracy with respect to the package dimensions marked * X, Y≤±0.2, θ≤±2° Stan
Open the catalog to page 3Dimensional outline (S8729-10, unit: mm) Photosensitive surface Tolerance unless otherwise noted: ±0.1, ±2° Chip position accuracy with respect to the package dimensions marked * X, Y≤±0.2, θ≤±2° Standard packing: stick (50 pcs/stick) Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer ∙ Metal, ceramic, plastic package products Technical information ∙ Si photodiode/Application circuit examples Information described in this material is current as of April 2019. Product specifications are subject to change without prior notice due to improvements or other reasons....
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