Surface mountable, high-speed response Si PIN photodiodes The S5106, S5107, S7509, and S7510 are Si PIN photodiodes sealed in surface mountable chip carrier packages. They can be mounted using solder reflow, which facilitates automation. Since the photosensitive area is large, they are suitable for FSO (free space optics) and other applications that require a wide field of view. In addition, they can be used in a wide variety of applications including POS, measurements, and analysis. Surface mount type ceramic chip carrier package Compatible with lead-free solder reflow Laser radars High sensitivity, high-speed response Power meters Barcode readers Window material Silicone resin Absolute maximum ratings Type no. S5106/-10 S5107/-10 S7509/-10 S7510/-10 Power dissipation Operating temperature Storage temperature P Topr*1 Tstg*1 (mW) (°C) (°C) 50 When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *2: Reflow soldering, JEDEC J-STD-020 MSL 3, see P.9 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings.

Electrical and optical characteristics (Typ. Ta=25 °C, unless otherwise noted) Spectral response (S5106, S5107, S7509, S7510) Spectral Peak response sensitivity range wavelength λ λp Cutoff Terminal Short circuit Dark current Dark current frequency capacitance NEP ID current temperature Ct VR=10 Photo sensitivity temperature characteristic (S5106,fc S5107, S7509, S7510 series) V VR=10 V coefficient Isc (A/W) RL=50 Ω f=1 MHz λ=λp 100 lx TCID VR=10 V VR=10 V Typ. Max. λp 660 nm 780 nm 830 nm (nA) (nA) (times/°C) (MHz) (pF) (W/Hz1/2) (µA) 27 0.4 5 20 40 1.6 × 10-14 110 0.9 10 10 150 2.4 × 10-14...

Dimensional outline (unit: mm) ensional outline (unit: mm) Dimensional outlines (unit: mm) S5106/-10 Silicone resin Photosensitive surface Silicone resin nsional outline (unit: mm) Photosensitive surface Index mark Dimensional outline (unit: mm) Burrs shall protrude no more than 0.3 mm on any side of package. Burrs shall protrude no more than 0.3 mm on any side of package. Photosensitive surface Silicone resin Photosensitive area Photosensitive surface Burrs shall protrude no more than 0.3 mm on any side of package. Burrs shall protrude no more than 0.3 mm on any side of package. KPINA0056EB

Recommended land patterns (unit: mm) S5107/-10 Recommended land pattern (unit: mm) S5106/-10 Recommended land pattern (unit: mm) 1. Solder all terminals. 2. Do not make the land area larger than necessary. 3. It is preferable that the land sizes be about equal. 4. Make land width x about the same as the terminal width. S7510/-10 5. Make land height y at least 1 mm longer than the terminal height, protruding outside the package. 1. Solder all terminals. 2. Do not make the land area larger than necessary. 3. It is preferable that the land sizes be about equal. 4. Make land width x about the same...

Standard packing specifications S5106, S5107, S7509, S7510 Packing quantity S5106, S7509: 100 pcs max./tray S5107, S7510: 50 pcs max./tray Packing state Tray and desiccant in moisture-proof packaging (vacuum-sealed) S5106-10 Reel (conforms to JEITA ET-7200) nsional outline (unit:Outer diameter mm) Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Packing quantity Packing state Reel and desiccant in moisture-proof packaging (vacuum

S5107-10 Reel (conforms to JEITA ET-7200) nsional outline (unit: mm) Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Packing quantity 100 pcs/reel Packing state Reel and desiccant in moisture-proof packaging (vacuum-sealed)

S7509-10 Reel (conforms to JEITA ET-7200) nsional outline (unit:Outer diameter mm) Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Packing quantity Packing state Reel and desiccant in moisture-proof packaging (vacuum

S7510-10 Reel (conforms to JEITA ET-7200) nsional outline (unit: mm) Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Packing quantity 100 pcs/reel Packing state Reel and desiccant in moisture-proof packaging (vacuum-sealed)

Recommended reflow soldering conditions 300 °C Peak temperature - 5 °C 30 s max. Cooling 6 °C/s max. Precautions ‧ his product’s light input window uses soft silicone resin. Stain or scratch in the light input window degrades the sensitivity. Avoid contact T with the light input window, as applying external force to the resin surface may cause the wire to deform and break. ‧ When soldering, use rosin-based flux to prevent terminal corrosion. Solder at 260 ° C or less within 5 seconds without moisture absorption. ‧ he effect that the product receives during reflow soldering varies depending on...

Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ‧ Disclaimer ‧ Surface mount type products Technical information ‧ Si photodiode / Application circuit examples Information described in this material is current as of January 2021. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification...