Plastic SIP (single in-line package) S2506/S6775 series and S6967 are Si PIN photodiodes with large active areas, molded into a clear or visible-cut plastic SIP for detecting visible to near infrared range or near infrared range only. These Si PIN photodiodes feature a high sensitivity, a highspeed response and large active areas. S2506-02: visible to near infrared range S2506-04: visible-cut S6775, S6967: visible to near infrared range, high sensitivity, high-speed response, large active area S6775-01, S6967-01: visible-cut, high sensitivity, high-speed response, large active area FSO (free space optics) Optical switches Laser radar, etc. Plastic package: 7 × 7.8 mm Photosensitive area size S2506 series: 2.77 × 2.77 mm S6775/S6967 series: 5.5 × 4.8 mm General ratings / Absolute maximum ratings Photosensitive Effective area size photosensitive area (mm) Absolute maximum ratings Power Operating dissipation temperature P Topr (mW) (°C) Storage temperature Tstg (°C) Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Typ. Ta=25 °C, unless otherwise noted) Spectral response range λ Peak sensitivity wavelength λp Temp. Cutoff Terminal Dark current coefficient frequency capacitance ID of fc Ct ID RL=50 Ω f=1 MHz Typ. Max. TCID -3 dB (pF) (nA) (nA) (times/°C) (MHz) 0.1*1

Spectral response S2506 series Photosensitivity temperature characteristics S2506 series (Typ.)

Dark current vs. reverse voltage Dark current Dark current vs. ambient temperature Terminal capacitance vs. reverse voltage (Typ.) Terminal capacitance Dark current

Relative sensitivity Dimensional outline (unit: mm) 2.7 ± 0.2 0.2 max. 7.0 ± 0.2 Center of 3.5 ± 0.2 Photosensitive area Details of lead root Tolerance unless otherwise noted: ±0.1 Packing: Polyethylene pack [anti-static type] Values in pare

Recommended soldering conditions Parameter Solder temperature Specification 260 °C max. (once, 10 s or less) Remarks at least 2 mm away from lead roots Note: When you set soldering conditions, check that problems do not occur in the prouct by testing out the conditions in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Notice ∙ Metal, ceramic, plastic package products Technical information ∙ Si photodiode/Application circuit examples Information described in this material is current as of May 2021. Product specifications are subject to change without prior notice...