COB type, applicable to lead-free solder reflow The S16392-01CT is a Si PIN photodiode for visible to near infrared range and is compatible with lead-free solder reflow processes. The small and thin leadless package allows reducing the mount area on a printed circuit board. COB type, small and thin leadless package FSO (free space optics) Optical switches Structure Parameter Photosensitive area Package Seal material Specification 2.77 × 2.77 Surface mount type glass epoxy Silicone Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Soldering temperature*2 Symbol VR max Topr Tstg Tsol *1: When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *2: Reflow soldering, JEDEC J-STD-020 MSL 4, see P.6 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characterisitcs (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Dark current Temperature coefficient of ID Cutoff frequency Terminal capacitance

Photosensitivity temperature coefficient (%/℃) Photosensitivity temperature characteristics Dark current vs. reverse voltage (Typ. Ta=25 °C, light source: 2856 K, VR=0 V) Dark current Short circuit current (A)

Terminal capacitance vs. reverse voltage Dark current vs. ambient temperature Dark current Directivity (Typ. Ta=25 °C, light source: tungsten lamp) Terminal capacitance Relative sensitivit

Dimensional outline (unit: mm) Photosensitive surface Index mark Center of photosensitive area Index mark Anode Cathode (common) Tolerance unless otherwise noted: ±0.1, ±2° Chip position accuracy with respect to package dimensions marked* X, Y≤±0.2, T≤±2° Au electrode Recommended land pattern (unit: mm)

Standard packing specifications Reel (conforms to JEITA ET-7200) Reel outer diameter 254 mm Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PC, electrically conductive) Countmark (10 poket step) Reel feed direction Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-se

Recommended reflow soldering conditions (typical example) 260 °C max. ‧ After unpacking, store this device in an environment at a temperature of 5 to 30 °C and a humidity below 60%, and perform reflow soldering on this device within 72 hours. ‧ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. Before actual cleaning, check for any problems by testing out the cleaning methods in advance. A sudden temperature rise and cooling may be the cause of trouble, so make sure that the temperature change is within 4 °C per second....