Si PIN photodiode for visible to infrared photometry The S15137 is a Si PIN photodiode developed for YAG lasers (1.06 µm). The photosensitivity at 1.06 μm is 0.52 A/W (typ.), which is about 1.5 times higher than that of previous products. The PIN structure allows high-speed response and low capacitance. The photosensitive area is as large as ϕ5 mm, making optical axis alignment easier. High sensitivity in infrared region: 0.52 A/W (λ=1.06 µm) Fiber laser detection Large photosensitive area: ϕ5 mm High reliability: TO-8 metal package Structure Parameter Photosensitive area Package Window material Specification ϕ5.0 TO-8 Borosilicate glass Absolute maximum ratings (Ta=25 °C) Parameter Reverse voltage Operating temperature Storage temperature Symbol VR Topr Tstg *1: When there is a temperature difference between a product and the surrounding area in high humidity environments, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. Note: xceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the E product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Short circuit current Dark current Temperature coefficient of ID Rise time Terminal capacitance

Spectral response Sensitivity temperature characteristics (Typ. Ta=25 °C) Previous product k current vs. reverse 0.2 voltage Terminal capacitance vs. reverse voltage Dark current vs. reverse voltage (Typ. Ta=25 °C) Terminal capacitance Dark current Terminal capacitance vs. reverse voltage

S15137 Dimensional outline (unit: mm) Dimensional outline (unit: mm) 13.9 ± 0.2 Photosensitive surface 1.0 max. KPINB0280EC Case Chip position accuracy with respect to the cap center X, Y≤±0.4 KPINA0092EB Recommended soldering condition ∙ Solder temperature: 260 °C max. (10 s or less, once) Note: When you set soldering conditions, check that problems do not occur in the product by testing out the conditions in

Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Notice ∙ Metal, ceramic, plastic package products Technical information ∙ Si photodiode / Technical note Information described in this material is current as of March 2022. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet...