Compact photosensor in a plastic package The S14016-01DT is a Si PIN photodiode for visible to near infrared range. It is provided in a compact surface mount type plastic package. Surface mount type, compact Optical switches Package size: 4 × 3 mm Photosensitive area: 1.8 × 2.1 mm High sensitivity: 0.7 A/W (λ=960 nm) Structure Parameter Photosensitive area Package Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Soldering temperature*2 Symbol VR max Topr Tstg Tsol *1: When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *2: Reflow soldering, JEDEC J-STD-020 MSL 4, see P.5 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Dark current Temperature coefficient of dark current Cutoff frequency Terminal capacitance

Spectral response Dark current vs. reverse voltage (Typ. Ta=25 °C) Dark current Terminal capacitance vs. reverse voltage Dark current vs. ambient temperature Dark current Terminal capacitance

Short circuit current vs. illuminance (Typ. Ta=25 °C, 2856 K, VR=0 V) Photosensitive surface Photosensitive area 3.2 ± 0.2 2.1 × 1.8 (including burr) Dimensional outline (unit: mm) Cathode (common) Cathode (common) Cathode (common) Anode 0.1 Short circuit current Tolerance unless otherwise noted: ±0.1, 2° Shaded area indicates burr. Chip position accuracy with respect to package dimensions marked * X, Y≤±0.2, θ

Recommended land pattern (unit: mm) Standard packing specifications Reel (conforms to JEITA ET-7200) Reel outer diameter 254 mm Electrostatic characteristics Conductive Embossed tape (unit: mm) Reel feed direction Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sea

Recommended reflow soldering conditions (typical example) ∙ After unpacking, keep it in an environment at 5 to 30 °C and a humidity of 60% or less. Perform reflow soldering within 72 hours. ∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. When you set reflow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. Drastic changes in temperature can cause problems. Set the temperature change to less than 4 °C/second. The content of this document is current as of...