High-speed response and wide temperature range The S13954-01CT is a photodiode that has an extremely wide operating and storage temperature range (-40 to +125 °C). A highspeed response (230 MHz typ.) is achieved. Laser power monitoring, etc. Operating/storage temperature: -40 to +125 °C Surface mount type, small and thin leadless package Photosensitive area: ϕ1.5 mm Suitable for lead-free solder reflow Structure Parameter Photosensitive area Package Window material Value ϕ1.5 Epoxy/Glass Silicone resin Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Reflow soldering conditions*1 Symbol VR max. Topr Tstg Tsol Value 10 -40 to +125 -40 to +125 Peak temperature: 260 °C, twice (see P.5) *1: JEDEC level 4 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characterisitcs (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Dark current Temperature coefficient of ID Cutoff frequency Terminal capacitance

Spectral response Photosensitivity temperature characteristics (Typ. Ta=25 °C) Dark current vs. reverse voltage Terminal capacitance vs. reverse voltage Terminal capacitance Dark current

Directivity (Typ. Ta=25 °C, light source: tungsten lamp) Relative sensitivi

Dimensional outline (unit: mm) Recommended land pattern 1.4 ± 0.2 Photosensitive surface Cathode index Photosensitive surface Tolerance unless otherwise noted: ±0.15, ±2° Chip position accuracy with respect to package center X, Y ≤ 0.2, θ ≤ ±2° KPINA0123EA Standard packing specifications Reel (conforms to JEITA ET-7200) Dimensions 254 mm Material Polystyrene Electrostatic characteristics Conductive Embossed tape (unit: mm, material: polystyrene, conductive) Reel feed direction 4.3 ± 0.1 Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packa

Recommended reflow soldering conditions 300 °C 260 °C max. ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 72 hours. ∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. Before actual reflow soldering, check for any problems by tesitng out the reflow soldering methods in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer ∙ Surface mount type products...