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Si PIN photodiode S13337-01

Si PIN photodiode S13337-01
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Si PIN photodiode for UV to near infrared region The S13337-01 is a surface mount type Si PIN photodiode in a ceramic package with glass. This achieves high-speed response in the UV to near infrared region. High-speed response Surface mount type, compact, chip carrier package Optical measurement equipment Compatible with lead-free reflow soldering Structure Parameter Photosensitive area Package Window material Specification ϕ0.8 Ceramic Borosilicate glass Absolute maximum ratings (Ta=25 °C) Parameter Reverse voltage Operating temperature Storage temperature Soldering temperature Symbol VR Topr Tstg Tsol *1: When there is a temperature difference between a product and the surrounding area in high humidity environments, dew condensation may occur on the product surface. Dew condensation on the product surface may cause deterioration in characteristics and reliability. *2: Reflpw soldering, JEDEC J-STD-020 MSL 2, see P.4 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Dark current Temperature coefficient of ID Cutoff frequency Terminal capacitance Noise equivalent power

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Photosensitivity temperature characteristics (Typ. Ta=25 °C) Terminal capacitance vs. reverse voltage 0 Dark current vs. reverse voltage 0.2 Photosensitivity temperature coefficient (%/°C) Spectral response Dark current vs. reverse voltage (Typ. Ta=25 ˚C) Terminal capacitance Dark current Terminal capacitance vs. reverse voltage

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Frequency response 70° Recommended land pattern (unit: mm) mensional outline (unit: mm) Dimensional outline (unit: mm) Index mark Recommended land pattern (unit: mm) Photosensitive surface (Typ. Ta=25 °C, light source: tungsten lamp) 0° 10° 20° 30° Index mark Tolerance unless otherwise noted: ±0.1 Chip position accuracy with respect to package center -0.2≤X≤+0.2 -0.2≤Y≤+0.2

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Recommended reflow soldering conditions Peak temperature - 5 °C 30 s max. Cooling 6 °C/s max. ⸱ fter unpacking, store the device in an environment A at a temperature of 30 °C or less and a humidity of 60% or less, and perform reflow soldering within 1 year. ⸱ The effect that the product receives during reflow soldering varies depending on the circuit board and the reflow oven that are used. When you set reflow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ⸱...

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