COB type, applicable to lead-free solder reflow The S10993-02CT is a Si PIN photodiode for visible to near infrared range and is compatible with lead-free solder reflow processes. The small and thin leadless package allows reducing the mount area on a printed circuit board. Small package: 3.1 × 1.8 × 0.8 mm Applicable to lead-free solder reflow Photosensitive area: 1.06 × 1.06 mm Structure Parameter Photosensitive area Package Seal material Specification 1.06 × 1.06 Glass epoxy Silicone resin Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Reflow soldering conditions*2 Symbol VR max Topr Tstg Tsol Value 10 -25 to +85 -40 to +100 Peak temperature 260 °C max., 2 times (see P.6) *1: When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *2: JEDEC level 2a Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Short circuit current Dark current Cutoff frequency Terminal capacitance

Spectral response Photosensitivity temperature characteristics (Typ. Ta=25 °C) Dark current vs. reverse voltage (Typ. 2856 K) Dark current Short circuit current

Terminal capacitance vs. reverse voltage (Typ. Ta=25 °C, f=1 MHz) Terminal capacitance Directivity (Typ. light: tungsten lamp) 20° Relative sensitivity (

Dimensional outline (unit: mm) 3.1 Photosensitive surface Photosensitive surface 0.6 Cathode Anode Tolerance unless otherwise noted: ± 0.1 Chip position accuracy with respect to package center X, Y≤±0.15 Electrode Index mark Recommended land pattern (unit: mm) 3.05 1.75

Standard packing specifications Reel (conforms to JEITA ET-7200) Dimensions Tape width Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Packing quantity 3000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-seal

Measured example of temperature profile with our hot-air reflow oven for product testing 300 °C ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 4 weeks. ∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. Before actual reflow soldering, check for any problems by testing out the reflow soldering methods in advance. Precautions Do not touch the silicone resin surface. As the silicone resin...