Surface mountable 16-element arrays The S8558 and S15158 are 16-element Si PIN photodiode arrays in surface mountable chip carrier packages. They can be mounted using solder reflow and used in a wide variety of applications such as spectrophotometers and distance measurement. Photosensitive area: 0.7 × 2.0 mm (× 16 elements) Surface mountable chip carrier package Distance measurement Compatible with lead-free solder reflow High sensitivity Structure Parameter Number of elements Element pitch Element size Package Window material Glass epoxy Silicone resin Absolute maximum ratings (Ta=25 °C) Parameter Reverse voltage Operating temperature*1 Storage temperature*1 Soldering conditions Symbol VR max Topr Tstg *1: o dew condensation. When there is a temperature difference between a product and the surrounding area in high humidity N environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *2: See P.5. JEDEC J-STD-020 MSL 3 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 °C, per element, unless otherwise noted) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Dark current Temperature coefficient of ID Cutoff frequency Noise equivalent power Terminal capacitance λ=λp VR=10 V VR=10 V, all 16 elements VR=10 V VR=10 V, RL=50 Ω λ=830 nm, -3 dB VR=10 V, λ=λp VR=10 V, f=10 kHz VR=10 V, f=10 kHz, all 16 elements

Spectral response Dark current vs. reverse voltage (per element) (Typ. Ta=25 °C) Dark current erminal capacitance vs. reverse voltage 0.1 Cutoff frequency vs. reverse voltage Terminal capacitance vs. reverse voltage (per element) (Typ. Ta=25 °C) Cutoff frequency vs. reverse voltage (per element) (Typ. Ta=25 °C, λ=830 nm, RL=50 Ω) Cutoff frequency Terminal capacitance

Dimensional outline (unit: mm) Dimensional outline (unit: mm) Dimensional outline (unit: mm) S8558 0.7 × 2.0 (× 16 elements) photosensitive area Recommended land pattern (unit: mm) 0.6 Recommended land pattern (unit: mm) Silicone resin Tolerance unless otherwise noted: ±0.25 KMPDA0144ED Silicone resin Photosensitive surface 0.7 × 2.0 (× 16 elements) Photosensitive area Photosensitive surface P1.3 × 8= 10.4 ± 0.05 Tolerance unless otherwise noted: ±0.1 Recommended land pattern (unit: mm) S15158 KMPDA0623EB 1. Solder all terminals. 2. Do not make the land area larger than necessary. 3. It is preferable...

Standard packing specifications S8558 Packing quantity 100 pcs max./tray Packing state Tray and desiccant in moisture-proof packaging (vacuum-sealed) Reel ing specifications (conforms to JEITA ET-7200) Dimensions 330 mm Electrostatic characteristics Conductive Index mark Embossed tape (unit: mm, material: PS, conductive) Reel feed direction KMPDC0789EA Packing quantity 1000 pcs/reel Packing state Reel and desiccant in moisture-proof packaging (vacuum-sealed)

Recommended reflow soldering conditions 300 °C ‧ fter unpacking, keep it in an environment at 5 to A 30 °C and a humidity of 60% or less, and perform soldering within 168 hours. ‧ he effect that the product receives during reflow T soldering varies depending on the circuit board and reflow oven that are used. ‧ hen you set reflow soldering conditions, check W that problems do not occur in the product by testing out the conditions in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ‧ Disclaimer ‧ Surface mount type products Technical information ‧ Si photodiodes /...