For visible to IR, general-purpose photometry These Si photodiodes have high sensitivity in the visible range to near IR. They provide higher sensitivity than the S2387 series and can be used in high-humidity environments. High sensitivity in visible to infrared range Analytical equipment Optical measurement equipment, etc. High linearity Structure / Absolute maximum ratings Window material Refractive index of window material Epoxy resin Absolute maximum ratings Effective Operating Storage photosensitive Reverse voltage temperature temperature area VR max Topr Tstg 2) (V) (mm (°C) (°C) 6.0 5.7 30 -20 to +60 -20 to +80 33 100 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Typ. Ta=25 °C, unless otherwise noted) Spectral Peak Photosensitivity response sensitivity S range wavelength λ=λp λp λ (nm) Short circuit Shunt Terminal Dark current Temp. Rise time current capacitance resistance ID tr coefficient Isc Rsh Ct VR=10 mV VR=0 V of ID 100 lx VR=0 V VR=10 mV TCID Max. RL=1 kΩ Min. Typ. f=10 kHz Min. Typ. (μA) (μA) (times/°C) (GΩ) (GΩ) (μs) (pA) (pF) 4.6 5.8 1.8 740 5 2 50 5.0 5.7 1.6 680 1.12 26 33 50 9 4000 0.2 10 76 95 200 33 13000 0.05 5 Noise equivalent power NEP VR=0 V λ=λp (W/Hz1/2) 9.0 × 10-16 2.0 × 10-15

Spectral response Photosensitivity temperature characteristics (Typ. Ta=25 °C) Dark current vs. reverse voltage Changes to spectral sensitivity due high temperature and high humidity Dark current

Dimensional outlines (unit: mm) S12915-16R Anode terminal mark 4.5 ± 0.2 Anode terminal mark Photosensitive surface Resin Photosensitive surface The resin potting may extend a maximum of 0.1 mm above the upper surface of the package. The resin potting may extend a maximum of 0.1 mm above the upper surface of the package. KSPDA0106EC Photosensitive surface Anode terminal mark 8.0 ± 0.3 Anode terminal mark The resin potting may extend a maximum of 0.1 mm above the upper surface of the package. KSPDA0110EB The resin potting may extend a maximum of 0.1 mm above the upper surface of th

Products corresponding to current products Current product S2387-16R S2387-33R S2387-66R S2387-1010R Related information http://www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer ∙ Metal, ceramic, plastic package products Technical information ∙ Si photodiode / Application circuit examples Information described in this material is current as of January 2019. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however,...