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Si photodiode S9981-01CT

Si photodiode S9981-01CT
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Applicable to lead-free solder reﬂow and wide temperature range The S9981-01CT is a photodiode that is applicable to lead-free solder reﬂow and has an extremely wide operating and storage temperature range (-40 to +125 °C). The small and thin leadless package allows reducing the mount area on a printed circuit board. Compatible with lead-free reflow soldering Raindrop detection Surface mount type, compact, thin leadless package Sunlight detection and the like Operating/storage temperature: -40 to +125 °C Photosensitive area: 1.3 × 1.3 mm High sensitivity: 0.65 A/W (λ=960 nm) Structure Parameter Photosensitive area Package Seal material Speciﬁcation 1.3 × 1.3 Glass epoxy Silicone resin Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Reﬂow soldering conditions Symbol VR max. Topr Tstg Tsol Value 10 -40 to +125 -40 to +125 Peak temperature: 250 °C, twice (see P.5) *1: When there is a temperature diﬀerence between a product and the surrounding area in high temperature environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Short circuit current Temperature coeﬃcient of short circuit current Half-power angle Dark current Temperature coeﬃcient of dark current Rise time Terminal capacitance

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Photosensitivity temperature characteristics (Typ. Ta=25 °C) Photosensitivity temperature coefficient (%/°C) Spectral response Dark current vs. reverse voltage (Ta=25 °C, light source: 2856 K, VR=0 V) Dark current Short circuit current

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Terminal capacitance vs. reverse voltage Directivity (Typ. Ta=25 °C, light source: tungsten lamp) Relative sensitivity (%) Dimensional outline (unit: mm) Recommended land pattern 1.4 ± 0.2 Photosensitive surface Photosensitive surface Terminal capacitance Tolerance unless otherwise noted: ±0.15, ±2° Chip position accuracy: with respect to package center X≤±0.2, Y

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Standard packing specifications Reel (conforms to JEITA ET-7200) Reel outer diameter 254 mm Material Polystyrene Electrostatic characteristics Conductive Embossed tape (unit: mm, material: polystyrene, conductive) Reel feed direction 3.6 ± 0.1 Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-se

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Recommended reflow soldering conditions 300 °C 250 °C max. ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 72 hours. ∙ The eﬀect that the product receives during reﬂow soldering varies depending on the circuit board and reﬂow oven that are used. When you set reﬂow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer ∙...

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