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Si photodiode S9674

Si photodiode S9674
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Applicable to lead-free solder reflow and wide temperature range The S9674 is a photodiode that is applicable to lead-free solder reﬂow and has an extremely wide operating and storage temperature range (-40 to +125 °C). The small and thin leadless package allows reducing the mount area on a printed circuit board. Suitable for lead-free solder reﬂow Rain sensor Surface mount type, small and thin leadless package Operating/storage temperature: -40 to +125 °C Photosensitive area: 2 × 2 mm High sensitivity: 0.7 A/W (λ=960 nm) Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Reﬂow soldering condition*1 Symbol VR max. Topr Tstg Tsol Value 10 -40 to +125 -40 to +125 Peak temperature 260 °C, two times (see page 5) Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. *1: JEDEC level 4 Electrical and optical characterisitcs (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photo sensitivity Short circuit current Temperature coefﬁcient of Isc Half-value angle Dark current Temperature coefﬁcient of ID Rise time Terminal capacitance Unit nm nm A/W μA %/°C degree nA times/°C

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Spectral response Photosensitivity temperature characteristics (Typ. Ta=25 °C) Dark current vs. reverse voltage Dark current Short circuit current

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Terminal capacitance vs. reverse voltage (Typ. Ta=25 °C, light source: tungsten lamp) Dimensional outline (unit: mm) 4.6 Photosensitive surface Cathode index Photosensitive surface Terminal capacitance Recommended land pattern Tolerance unless otherwise noted: ±0.

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Standard packing specifications Reel (conforms to JEITA ET-7200) Dimensions 254 mm Material Polystyrene Electrostatic characteristics Conductive Embossed tape (unit: mm, material: polystyrene, conductive) Reel feed direction 4.3 ± 0.1 Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-s

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Measured example of temperature profile with our hot-air reflow oven for product testing 300 °C 260 °C max. ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 72 hours. ∙ The effect that the product receives during reﬂow soldering varies depending on the circuit board and reﬂow oven that are used. Before actual reﬂow soldering, check for any problems by tesitng out the reﬂow soldering methods in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html...

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