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Si photodiode S10625-01CT

Si photodiode S10625-01CT
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COB type, applicable to lead-free solder reﬂow The S10625-01CT is a Si photodiode for visible to near infrared range and is compatible with lead-free solder reﬂow processes. The small and thin leadless package allows reducing the mount area on a printed circuit board. Optical switches Small package: 3.2 × 2.7 × 1.1t mm Applicable to lead-free solder reﬂow Photosensitive area: 1.3 × 1.3 mm Structure Parameter Photosensitive area Package Seal material Speciﬁcation 1.3 × 1.3 Glass epoxy Epoxy resin Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Reﬂow soldering conditions*1 Symbol VR max Topr Tstg Tsol Value 10 -25 to +85 -40 to +100 Peak temperature 240 °C max., 1 time (see page 5) Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. *1: JEDEC level 4 Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Short circuit current Dark current Temperature cofﬁcient of ID Rise time Terminal capacitance

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Spectral response Short circuit current vs. light level (Typ. Ta=25 °C) Short circuit current Directivity (Typ. Ta=25 °C, light source: tungsten lamp) Relative sensitiv

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Dark current vs. reverse voltage Terminal capacitance vs. reverse voltage Terminal capacitance Dimensional outlines (unit: mm) Recommended land pattern (unit: mm) 1.5 Photosensitive surface Photosensitive surface Component placement example 1.1 Anode (common) Cathode (common) Tolerance unless otherwise noted: ±0.2 Chip position accuracy with respect to package dimensions marked * X, Y≤±0.3 Electrode Dark current

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Standard packing specifications Reel (conforms to JEITA ET-7200) Dimensions Tape width Electrostatic characteristics - Reel feed direction Embossed tape (unit: mm, material: PC) Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sealed

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Measured example of temperature profile with our hot-air reflow oven for product testing 300 °C 240 °C max. ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 72 hours. ∙ The effect that the product receives during reﬂow soldering varies depending on the circuit board and reﬂow oven that are used. Before actual reﬂow soldering, check for any problems by tesitng out the reﬂow soldering methods in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html...

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