COB type, applicable to lead-free solder reflow The S10625-01CT is a Si photodiode for visible to near infrared range and is compatible with lead-free solder reflow processes. The small and thin leadless package allows reducing the mount area on a printed circuit board. Optical switches Small package: 3.2 × 2.7 × 1.1t mm Applicable to lead-free solder reflow Photosensitive area: 1.3 × 1.3 mm Structure Parameter Photosensitive area Package Seal material Specification 1.3 × 1.3 Glass epoxy Epoxy resin Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Reflow soldering conditions*1 Symbol VR max Topr Tstg Tsol Value 10 -25 to +85 -40 to +100 Peak temperature 240 °C max., 1 time (see page 5) Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. *1: JEDEC level 4 Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Short circuit current Dark current Temperature cofficient of ID Rise time Terminal capacitance

Spectral response Short circuit current vs. light level (Typ. Ta=25 °C) Short circuit current Directivity (Typ. Ta=25 °C, light source: tungsten lamp) Relative sensitiv

Dark current vs. reverse voltage Terminal capacitance vs. reverse voltage Terminal capacitance Dimensional outlines (unit: mm) Recommended land pattern (unit: mm) 1.5 Photosensitive surface Photosensitive surface Component placement example 1.1 Anode (common) Cathode (common) Tolerance unless otherwise noted: ±0.2 Chip position accuracy with respect to package dimensions marked * X, Y≤±0.3 Electrode Dark current

Standard packing specifications Reel (conforms to JEITA ET-7200) Dimensions Tape width Electrostatic characteristics - Reel feed direction Embossed tape (unit: mm, material: PC) Packing quantity 2000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sealed

Measured example of temperature profile with our hot-air reflow oven for product testing 300 °C 240 °C max. ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 72 hours. ∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. Before actual reflow soldering, check for any problems by tesitng out the reflow soldering methods in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions...