Si photodiode for visible to near infrared region The S16008-33 is a surface mount type Si photodiode with high sensitivity in the visible to near infrared region. This provides higher sensitivity than the previous S2387 series. High sensitivity in visible to near infrared region Analytical equipment Optical measurement equipment Superior linearity Compatible with lead-free solder reflow Structure Parameter Photosensitive area Package Window material Specification 2.4 × 2.4 Glass epoxy Silicone resin Absolute maximum ratings (Ta=25 °C, unless otherwise noted) Parameter Reverse voltage Operating temperature Storage temperature Soldering temperature Symbol VR Topr Tstg Tsol *1: When there is a temperature difference between a product and the surrounding area in high humidity environments, dew condensation may occur on the product surface. Dew condensation may cause deterioration in characteristics and reliability. *2: Reflow soldering, JEDEC J-STD-020 MSL 2a, see P.4 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Dark current Temperature coefficient of ID Rise time Terminal capacitance Shunt resistance Noise equivalent power

Spectral response Photosensitivity temperature characteristics (Typ. Ta=25 °C) Terminal capacitance vs. reverse voltage 0 Dark current vs. reverse voltage 0.2 Dark current vs. reverse voltage Terminal capacitance vs. reverse voltage Terminal capacitance Dark current

Dimensional outline (unit: mm) Dimensional outline (unit: mm) Photosensitive area (2.4 × 2.4) Index mark Recommended land pattern (unit: mm) Photosensitive surface Silicone resin Tolerance unless otherwise noted: ±0.1 Chip position accuracy with respect to package center: ±0.1 Index mark Standard packing specifications Standard packing Reel (conforms to JEITA ET-7200) Outer diameter ϕ180 mm Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Index mark Reel feed direction KSPDC0102EA Packing quantity 1000 pcs/reel Packing state Reel and desiccant in moisture-proof...

Recommended reflow soldering conditions 300 °C Peak temperature 260 °C max. Temperature increase 3 °C/s max. Peak temperature - 5 °C 30 s max. Cooling 6 °C/s max. ∙ fter unpacking, store the device in an environment A at a temperature of 30 °C or less and a humidity of 60% or less, and perform reflow soldering within 4 weeks. ∙ he effect that the product receives during reflow T soldering varies depending on the circuit board and the reflow oven that are used. When you set reflow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. Related...