High speed, compact Si APD for LiDAR (700 nm band) featuring low-bias operation This Si APD is suitable for detecting light in the 700 nm band, which is increasingly used in optical rangefinders. With the same shape as the previous product (S10341 series), this Si APD features less variation in breakdown voltage, reduced dark current, and expanded storage and operating temperatures. Optical rangefinders Peak sensitivity wavelength: 760 nm (M=100) Low-bias operation: Breakdown voltage=120 V max. H igh-speed response: Cutoff frequency=2 GHz typ. (λ=760 nm, M=100) Reduction of breakdown voltage variation 100 ± 20 V Structure Parameter Photosensitive area*1 Effective photosensitive area Package Specification ϕ0.2 0.03 Plastic (silicone resin) Specification -30 to +100 -40 to +100 0.2 10 Peak temperature: 260 °C (see P.4), JEDEC level 2a *1: Area in which a typical gain can be obtained Absolute maximum ratings Parameter Operating temperature Storage temperature Reverse current (DC) Forward current Soldering conditions Symbol Topr Tstg IR max IF max - Note: xceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the E product within the absolute maximum ratings.

Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Quantum efficiency Breakdown voltage Temperature coefficient of Spectral response breakdown voltage Dark current Temperature coefficient of dark current Cutoff frequency Terminal capacitance Excess noise figure Gain Quantum efficiency vs. wavelength 0.42 - Quantum efficiency vs. wavelength Quantum efficiency (%)

Dark current vs. reverse voltage Terminal capacitance vs. reverse voltage Gain vs. reverse voltage (Typ. λ=760 nm)

(Typ. M=100, light source: tungsten lamp) 0° 10° 20° 30° 70° Recommended reflow soldering condition 80° Recommended solder reflow conditions 300 °C Peak temperature - 5 °C 30 s max. Cooling 6 °C/s max. ∙ After unpacking, keep it in an environment at 30 °C or less and a humidity of 60% or less, and perform soldering within 4 weeks. ∙ he effect that the product receives during reflow T soldering varies depending on the circuit board and reflow oven that are used. ∙ hen you set reflow soldering conditions, check W that problems do not occur in the product by testing out the conditions in advance....

Dimensional outline (unit: mm) Dimensional outline (unit: mm) 0.6 0.85 0.85 0.6 Cathode mark Photosensitive surface Recommended land pattern Tolerance unless otherwise noted: ±0.2 Position accuracy of photosensitive area: X, Y≤±0.2 KAPDA0203EA Standard packing specifications ndard packing specifications Reel (conforms to JEITA ET-7200) Dimensions 180 mm Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) 1.75 ± 0.1 Packing quantity 1000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sealed)

Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer ∙ Surface mount type products Information described in this material is current as of January 2019. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. The product warranty is...