One channel distance measurement photo IC for indirect TOF (time-of-flight) The S13021-01CT is a distance measurement device using the indirect TOF method. It integrates Hamamatsu’s CMOS sensor and signal processing circuit. The sensor outputs signals proportional to the time for the pulse-modulated light to reflect by the target object and return. The output value can be used to calculate the distance to the target object. The S1302101CT runs on low voltage (3.3 V) and supports I2C interface and SPI. Distance measurement Presence or absence of objects Structure Parameter Specification 0.4 × 0.4 Glass epoxy Epoxy resin Photosensitive area Package Seal material Absolute maximum ratings (Ta=25 °C) Parameter Symbol Value Supply voltage Vdd -0.3 to +4.6 Load current Io ±10 Power dissipation P 100 Operating temperature Topr -25 to +65 Storage temperature Tstg -40 to +85 Soldering temperature Tsol 240 (once)*1 *1: Reflow soldering, IPC/JEDEC J-STD-020 MSL 5a, see P.14 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to product within the absolute maximum ratings.

Recommended operating conditions Parameter Supply voltage I2C bus pull-up High level input voltage Low level input voltage Bus capacitance Clock frequency Resolution Symbol Vdd(A) Vdd(D) Vbus Vih Vil Cbus Fclk - *2: The pull-up resistance is determined by the Cbus and Vbus values. Electrical and optical characteristics [Ta=25 °C, Vdd(A)=Vdd(D)=3.3 V, CLK=50 MHz] Sensor area Parameter Symbol Condition Min. Typ. Spectral response range λ 440 to 1000 800 Peak sensitivity wavelength λp Current consumption 9.3 Icc Photosensitivity*3 RES 15600 Output value*4 Vor When dark -6000 0 Output value Vsat...

SPI area Only the data output function is used for the SPI. Parameter SPI clock frequency High level output voltage Low level output voltage High level input voltage Low level input voltage SPI data format Number of readout bits Ndata_counter Which iteration the data was read out 41 42-48 Dark frame Operation flag Dummy data 1: Dark frame All zeros 0: LED light emission frame MSB first for all data For Ch1 data, the first bit is the MSB, and the 16th bit is the LSB. DRDY CS SPCLK SPDATA From the completion of ADC conversion to the rising edge of DRDY From the rising edge of DRDY to the falling edge...

Function Sensor control r_seq_ dark_frame fixed value fixed value Analog control Ndata_counter fixed value Nlight Ndata VTX1 VTX2 Distance measurement control fixed value pres_width Fixed value registers are operation settings for ran

Register table Mode Global control Register address Description 1: ADC reset on The internal register is reset to its initial condition, and operation is stopped. Operation starts when ADC reset is set to ON once and then set to OFF. 0: ADC reset off ADC output result on the data1 side, 16-bit Signed 16-bit integer with the most significant bit being the sign bit ADC output result on the data2 side, 16-bit Signed 16-bit integer with the most significant bit being the sign bit Light frame (with L_trig) or dark frame (without L_trig) 1: Dark frame 0: Light frame Which data readout iteration this...

Register address Hexadecimal notation Binary notation ADC_RESET must be changed as follows: 0→1→0.

Flowchart 1. Power on 2. Power on reset, initialize 3. ADC reset enable 4. Measurement condition setting 5. ADC reset disable 6. Pixel reset 8. A/D conversion, register storage 12. A/D conversion, register storage Was data read out the number of times specified by Ndata? Yes Was data read out the number of times specified by Ndata? Yellow indicates operations performed by the user, and blue the product’s internal operation. When the IC receives power and CLK, the built-in power-on reset circuit operates to set all registers to their initial conditions (2). To enter measurement conditions, enter...

Spectral response (typical example) (Ta=25 °C) Relative sensitivity (%) Block diagram IC timing circuit TOF sensor Microcontroller FPGA

Operation timing L_trig timing L_trig is a pulse signal synchronized to VTX1. L_trig Timing chart 1 frame p_res(width) p_res VTX enable L_res VTX1 width VTX1 VTX2 width VTX2 VTX3 width VTX3 VTX enable KPICC0280EA

Operating circuit example Vdus (3.3 V) SPCLK Microcontroller

Dimensional outline (unit: mm) 8.0 Index mark Index mark Tolerance unless otherwise noted: ±0.1 Chip position accuracy with respect to package dimensions marked * X, Y≤±0.2, θ≤±0.2 Values in parentheses indicate reference values. KPICA0099EA Recommended land pattern (unit: mm) 6.0 1.0

Symbol Vdd(A) Vref AGND T1 CLK SPCLK SDA SCL L_trig Add_sel1 Add_sel2 DGND NC Vdd(D) NC AGND NC Function Power supply Analog Power supply Digital Digital Description Analog supply voltage Internal reference voltage Analog ground Test terminal Master clock input SPI clock Negative data standby output Digital 0: Not standby 1: Data standby Digital SPI data output Negative chip selection input Digital 0: Selected 1: Not selected Digital I2C data (SDA) Digital I2C clock (SCK) Digital Optical pulse trigger Digital I2C address switch flag Digital I2C address switch flag Power supply Digital ground No...

Standard packing specifications Reel Dimensions Tape width Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Reel feed direction Packing quantity 1000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-s

Recommended soldering conditions 300 °C 240 °C max. ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 24 hours. ∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. When you set reflow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer ∙ Surface mount...