Inverted Emission Microscope iPHEMOS
4Pages

{{requestButtons}}

Catalog excerpts

Inverted Emission Microscope  iPHEMOS - 1

Inverted Emission Microscope Rapidly and precisely localizes semiconductor failure sites through photo emission, thermal emission and laser based techniques. Hamamatsu offers the latest generation of inverted optical analysis tools for simplified direct tester docking and backside wafer probing. Series Tester direct docking type Back side prober type -TD -TP Tester direct docking type -SD

Open the catalog to page 1
Inverted Emission Microscope  iPHEMOS - 2

FEATURES OPTIONS NanoLens for high-resolution and high-sensitivity observation Using a NanoLens increases the numerical aperture (N. A.) and drastically improves both resolution and light collection efficiency. This shortens detection time yet delivers high resolution. OBIRCH analysis function The highly popular OBIRCH (Optical Beam Induced Resistance Change) analysis function can be added as an option to detect line defects such as leakage or IDDQ defects. Use of digital lock-in kit enhances the OBIRCH analysis detection functions Digital lock-in by the software ensures a clear and sharp...

Open the catalog to page 2
Inverted Emission Microscope  iPHEMOS - 3

For details on the optional analytical functions and detectors, see the PHEMOS catalog or the various technical notes. High precision backside prober for 300 mm wafers with multiple platforms Equipped with a backside emission prober (BEP) made for 300 mm wafers by SUSS MicroTec. Rapid and accurate multiple pins probing or micro-probing on a wafer enables highly efficient analysis from the backside of a wafer. Its multiple platforms and a full line of options including several laser application options and wafer automatic measurement software offer a wide range of backside analysis. A...

Open the catalog to page 3
Inverted Emission Microscope  iPHEMOS - 4

SELECTION SELECTION Hamamatsu Photonics classifies laser diodes, and provides appropriate safety measures and labels according to the classification as required for manufacturers according to IEC 60825-1. When using this product, follow all safety measures according to the IEC. LASER SAFETY CLASS É LASER PRODUCT Description Label Caution Label Cat. No. SSMS0019E10 OCT/2009 HPK Created in Japan Type Name Port for Detector for CAMERA for LASER CAMERA Selection C-CCD Camera : C4880-59 SI-CCD Camera : C11231-02 InGaAs Camera (LN2 cooling ) : C8250-25 1 InGaAs Camera (Peltier cooling) : C8250-26...

Open the catalog to page 4

All HAMAMATSU catalogs and technical brochures

  1. SPAD MODULES

    5 Pages

  2. LIGHTNINGCURE

    29 Pages

  3. C13410-06A

    4 Pages

  4. PMA-12

    8 Pages

  5. L12542

    4 Pages

  6. FLAT EXCIMER

    16 Pages

  7. L15208-01

    3 Pages

  8. L15856-01

    3 Pages

  9. L14001-01

    2 Pages

  10. L14351-02

    4 Pages

  11. GC-113A

    2 Pages

  12. DIUTHAME

    12 Pages

  13. J12853

    2 Pages

  14. J12432-01

    2 Pages

  15. C15780-401

    4 Pages

  16. H15460-40

    4 Pages

  17. R14755U-100

    2 Pages

  18. LIGHT SOURCES

    23 Pages

  19. PHOTOTUBES

    8 Pages

  20. PSD

    8 Pages

  21. Photo IC

    8 Pages

  22. Image Sensors

    48 Pages

  23. Si Photodiodes

    48 Pages

  24. Si APD

    16 Pages

  25. FLOW CELLS

    4 Pages

  26. Si photodiodes

    41 Pages

Archived catalogs