Catalogs >
HAMAMATSU >
Infrared LED L12509 series

Infrared LED L12509 series
9Pages

Catalog excerpts

Peak emission wavelength: 1.55 μm The L12509 series is a high-power LED that emits infrared light at a peak wavelength of 1.55 μm. The LED is suitable for applications requiring use of infrared emitters with InGaAs photodiode. High light output High reliability Analytical instruments Compact, surface mount type package (1.6 × 0.8 × 0.7t mm): L12509-0155G Near infrared lighting Compatible with lead-free reflow: L12509-0155G Package Surface mount type glass epoxy TO-46 TO-46 Plastic Window material Silicone resin Borosilicate glass Lens type borosilicate glass Bullet-shaped epoxy resin Absolute maximum ratings (Ta=25 °C unless otherwise noted) Type no. L12509-0155G L12509-0155K L12509-0155L L12509-0155P Forward current Pulse forward Pulse forward current Operating Storage Solder Power decrease rate current decrease rate dissipation temperature temperature temperature Ta>25°C IFP*1 Ta>25°C Topr*2 Tstg*2 Tsol P (A) (°C) (°C) (mA/°C) (mA/°C) (°C) (mW) 0.8 0.5 5 250 (twice)*3 -40 to +100 150 1.1 13 -30 to +85 1.0 1.0 10 -30 to +100 *1: Pulse width=10 μs, duty ratio=1% *2: No dew condensation. When there is a temperature diﬀerence between a product and the surrounding area in high humidity environments dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *3: JEDEC J-STD-033C MSL 2a, see P.8 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings.

Open the catalog to page 1

Electrical and optical characteristics (Ta=25 °C) Peak emission wavelength λp IF=50 mA Min. Typ. Max. (nm) (nm) (nm) 1500 Spectral half width ∆λ IF=50 mA Typ. (nm) Radiant intensity Ie IF=50 mA Min. Typ. Min. Typ. (mW) (mW) (mW/str) (mW/str) 2.2 3.0 1.3 1.9 1.8 2.7 3.8 10 16 Radiant ﬂux ϕe IF=50 mA *4: IF=50 mA ± 10 mAp-p. Frequency at which the light output drops by 3 dB based on light output at 100 kHz Emission spectrum Radiant flux vs. pulse forward current (Typ. Ta=25°C, IF=50 mA) Relative light output (%) Pulse forward current (mA) KLEDB0435EB Pulse forward current vs. pulse forward...

Open the catalog to page 2

Relative light output (%) KLEDB0487EB

Open the catalog to page 3

Light output vs. ambient temperature Allowable forward current vs. ambient temperature Relative forward current (%) Relative light output (dB) Allowable forward current vs. duty ratio L12509-0155G Duty ratio (%) Allowable forward current (A) Allowable forward current (A)

Open the catalog to page 4

Allowable forward current (A) Dimensional outlines (unit: mm) L12509-0155G Recommended land pattern Electrode Chip position accuracy with respect to package center -0.25≤X≤+0.05 -0.15≤Y≤+0.15 Tolerance unless otherwise noted: ±0.1 Standard packing state: reel (2000 pcs/roll) KLEDA0107EB Standard packing state: Paper box (200 piec

Open the catalog to page 5

Standard packing state: Paper box (200 pieces/box) KLEDA0091EB 2.5 (specified at lead root) Standard packing state: anti-static bag (100 pcs/pac

Open the catalog to page 6

Standard packing speciﬁcations (L12509-0155G) Reel (conforms to JEITA ET-7200) Outer diameter ϕ180 mm Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Reel feed direction 0.9 ± 0.05 Packing quantity 2000 pcs/reel Packing state Reel and desiccant in moisture-proof packaging (vac

Open the catalog to page 7

Recommended solering conditions L12509-0155G ∙ After unpacking, store the device in an environment at a temperature range of 5 to 30 °C and a humidity of 60% or less, and perform reﬂow soldering within 4 week. ∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. When you set reflow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. L12509-0155K/-0155L ∙ Solder temperature: 260 °C (5 s or less, once) Solder the leads at a point at least 1 mm away from...

Open the catalog to page 8

Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer ∙ Metal, ceramic, plastic packages ∙ Surface mount type products Technical information ∙ LED / Technical note Information described in this material is current as of July 2021. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery...

Open the catalog to page 9