Catalog excerpts
Distance area image sensor S15454-01WT NIR-enhanced type, measures the distance to an object by TOF method The distance image sensor is designed to measure the distance to an object by TOF (time-of-flight) method. When used in combination with a pulse modulated light source, this sensor outputs phase difference information on the timing that the light is emitted and received. Distance data can be obtained by performing calculation on the output signal with an external signal processing circuit or on a PC. We provide an evaluation kit for this product. Contact us for detailed information. High sensitivity in the near infrared region Obstacle detection (self-driving, robots, etc.) Improved tolerance to background light Security (intrusion detection, etc.) Number of effective pixels: 96 (H) × 72 (V) Shape recognition (logistics, robots, etc.) Compact chip size package (CSP) type Motion capture Touchless operation Structure Parameter Image size Pixel size Pixel pitch Number of pixels Number of effective pixels Package Note: This product is not hermetically sealed. Unit mm μm μm pixels pixels - Absolute maximum ratings Parameter Analog supply voltage Digital supply voltage Pixel reset Analog input VTX power supply terminal voltage Photosensitive area Frame reset pulse Frame sync trigger pulse Digital input Line sync trigger pulse terminal voltage Pixel reset pulse Master clock pulse Charge transfer clock pulse voltage Operating temperature Storage temperature Soldering temperature*2 Symbol Vdd(A) Vdd(D) Vr Vdd(VTX) Vpg reset vst hst ext_reset mclk VTX1, VTX2, VTX3 Topr Tstg Tsol *1: When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *2: Reflow soldering, IPC/JEDEC J-STD-020 MSL 2, see P.10 Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum rating
Open the catalog to page 1Distance area image sensor Recommended terminal voltage (Ta=25 °C) Parameter Analog supply voltage Digital supply voltage Pixel reset Bias voltage VTX power supply Photosensitive area High level Frame reset pulse voltage Low level Frame sync trigger pulse High level voltage Low level High level Line sync trigger pulse voltage Low level High level Master clock pulse voltage Low level High level Pixel reset pulse voltage Low level Output signal sync pulse High level voltage Low level Symbol Vdd(A) Vdd(D) Vr Vdd(VTX) Vpg reset vst hst mclk ext_reset dclk Min. 3.2 3.2 2.5 1.6 0.6 Vdd(D) ×...
Open the catalog to page 2Distance area image sensor Spectral response (typical example) Basic connection example Buffer amp Block diagram GND(A) Vdd(A) Vdd(VTX) C2 A3 D2 Vertical shift register Relative sensitivity GND(VTX) GND(VTX) Vdd(VTX) B4 A4 B5 Bias generator Photodiode array 104 × 80 pixels (Number of effective pixels 96 × 72) B1 Vr ext_reset reset vst hst mclk Sample-and-hold circuit Timing generator D1 Vout2 Horizontal shift register
Open the catalog to page 3Distance area image sensor Timing chart F1 mclk (10 MHz) t1 ext_reset Integration period Integration period Output light Output light
Open the catalog to page 4Distance area image sensor tf(Hst) MCLK DCLK tr(Vst) MCLK tr(Ext_reset) Calculation method of frame rate Frame rate=1/4 of subframe time =1/{(Integration time + Readout time) × 4} When operating in non-destructive readout mode Time per subframe=Integration time + (Readout time × Non-destructive readout count) Note: The integration time setting needs to be changed depending on the required distance accuracy and usage environment factors such as background light. Integration signal can be read out without reading out the reset level. But this may increase random noise and degrade sensitivity...
Open the catalog to page 5Distance area image sensor Parameter Symbol Master clock pulse duty ratio Master clock pulse rise and fall times*7 tr(mclk), tf(mclk) Frame reset pulse rise and fall times*7 tr(reset), tf(reset) Frame sync trigger pulse rise and fall times*7 tr(vst), tf(vst) Line sync trigger pulse rise and fall times*7 tr(hst), tf(hst) Pixel reset pulse high period thp(ext_reset) Pixel reset pulse rise and fall times tr(ext_reset), tf(ext_reset) Time from falling edge of master clock pulse to rising t1 edge of pixel reset pulse Time from falling edge of pixel reset pulse to rising edge t2 of frame reset...
Open the catalog to page 6Distance area image sensor Parameter Charge transfer clock pulse cycle High period High period Charge transfer clock pulse (VTX3) High period Charge transfer clock pulse (VTX2) Charge transfer clock pulse (VTX1) tr(VTX), tf(VTX) Charge transfer clock pulse voltage rise and fall times*7 High level Charge transfer clock pulse voltage Low level Input terminal capacitance (Ta=25 °C, Vdd=3.3 V) Parameter Charge transfer clock pulse internal load capacitance Dimensional outline (unit: mm) Recommended land pattern (unit: mm) Vertical direction of scan 1st pixel Horizontal direction of scan...
Open the catalog to page 7Distance area image sensor Symbol GND(A) Vr Vout1 Vout2 NC Vdd(A) Vpg Vdd(A) GND(A) Vdd(D) Vdd(VTX) NC NC NC NC GND(VTX) GND(VTX) vst NC Vdd(D) VTX3 VDD(VTX) ext_reset mclk GND(D) VTX2 VTX1 reset hst dclk Description Ground Pixel reset voltage Output signal 1 Output signal 2 No connection Analog supply voltage Photosensitive area bias voltage Analog supply voltage Ground Digital supply voltage Power supply for VTX No connection No connection No connection No connection Ground Ground Vertical shift register start signal No connection Digital supply voltage Charge transfer clock 3 (for OFD)...
Open the catalog to page 8Distance area image sensor Reel packing specifications Reel (conforms to JEITA ET-7200) Outer diameter ϕ180 mm Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) Packing quantity 500 pcs/reel Packing state Reel and desiccant in moisture-proof packaging (vacuum-
Open the catalog to page 9Distance area image sensor Recommended soldering conditions 300 °C 245 °C max. ⸱ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 1 year. ⸱ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. When you set reflow soldering conditions, check that problems do not occur in the product by testing out the conditions in advance. ⸱ In order to improve reliability, we recommend that you use...
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