%JL>r! I Testing instruments WWW.gbprtester.com Chip Package Testing Solution WVTR stands for Water Vapor Transmission Rate, which is a measure of the rate at which water vapor permeates through a barrier at a specified temperature and relative humidity. In the context of chip package testing, WVTR is a critical parameter for assessing the moisture barrier properties of the package, which is essential to ensure the long-term reliability of the semiconductor device, especially for moisture-sensitive devices. The standards for measuring WVTR in the context of semiconductor packaging are often part of broader standards for hermeticity testing. However, specific WVTR standards can include: ASTM F1249 This is a standard test method for water vapor transmission rate through plastic film and sheeting using a modulated infrared sensor. While this standard is more common in the plastics industry, it can also be applied to the barrier layers used in semiconductor packaging. ISO 15106 This is an international standard that specifies a method for determining the water vapor transmission rate of plastic film, sheeting, paper, or other materials used in packaging. ASTM E398 This standard test method measures the rate of water vapor transmission through flexible barrier materials using a desiccant method or a water method. For chip packages, controlling moisture ingress is crucial because moisture can lead to various failure mechanisms such as corrosion, electrical leakage, or physical defects like the lamination or "popcorning" during solder reflow processes. Tensile properties of chip packaging materials ASTM D882 Standard test method for tensile properties of thin plastic sheeting. Electronic Tensile Tester GBH-2 is suitable for tensile, peeling, heat sealing, tearing, puncturing, compression, bending, shearing and other tests of various metal and non-metallic materials, and then calculates parameters such as breaking strength and elastic modulus of materials, and can also be used in the medical industry It is an indispensable testing equipment for physical property testing, teaching research, quality control, etc.

\JDmM | Testing instruments WWW. gbpitester. com Leak detection in chip package testing is a critical quality control step, as it ensures the integrity of the chip package, particularly for those that require a hermetic seal to protect the internal components from moisture, contaminants, and other environmental factors. Various standards and methods are used in the industry to define how leak detection should be performed and to what degree of sensitivity. ISO 11607 ISO 11607 is a part of the standard for packaging for terminally sterilized medical devices, which includes requirements for package...

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