Semiconductor Parts Drying Solutions For ASML/ Nikon Parts Technical Specifications： After cleaning the components of a lithography machine, vacuum drying is required to ensure the removal of residual moisture and contaminants. This process involves placing the parts in a sealed chamber where air pressure is reduced, allowing moisture to evaporate at lower temperatures without damaging sensitive optics or electronics. The vacuum environment also prevents oxidation and maintains the integrity of high-precision surfaces. Technical Specifications： ✔ Vacuum Range: 10 ⁻ ³ to 10 ⁻ ⁷ Pa (configurable for EUV, DUV, and advanced packaging) ✔ Temperature Range: 80 ° C to 450 ° C (precision-controlled for optics, metals, and coatings) ✔ Gas Purging System: N ₂ , Ar, H ₂ , or custom mixes (0.1 – 0.5 MPa, pulsed/continuous flow) ✔ Plasma-Assisted Cleaning (Optional): O ₂ , Ar plasma (50 – 300W) for organic/polymer removal ✔ Ultrasonic Enhancement (Optional): 40–80 kHz for particle dislodgement (low-pressure safe) ✔ Material Compatibility: Si/Mo mirrors, SiC, Al ( ≤ 200 ° C), stainless steel, ceramics ✔ Process Monitoring: Real-time RGA (Resi