CHEMRAZ® E38 Minimal Contamination in Dry Plasma Processes SEALING SOLUTIONS Chemraz® E38 was specifically developed for high-density plasma systems and diffusion processes where seal reliability and very minimal contamination are essential. The material provides excellent chemical compatibility and withstands a variety of aggressive chemicals. Available in an infinite range of geometries and cross sections, this material offers the diversity required for a variety of dynamic or static dry processing applications. Recommended for slit valves, Chemraz E38 remains stable at service temperatures as high as 260ºC (500°F) where high sealing loads are not used. FEATURES & BENEFITS • Minimal contamination TYPICAL PROPERTIES* • Withstands a variety of aggressive chemicals Physical Color Typical Value White Polymer Type • Unlimited design flexibility Specific Gravity • Excellent physical properties Tensile Strength, psi (kPa) • Bonded gate seals • Chamber seals RECOMMENDED PROCESS APPLICATIONS Compression Set: 70 hours @ 204ºC @ 25% Deflection, % • Remote plasma cleans • Oxidation (LPCVD) Service Temperature Range • Diffusion • Metalization (CVD, PVD, sputtering, evaporation) * Note: Unless otherwise indicated, all tests are performed on AS 568A (-214) O-rings. • Dry plasma etch • Dry ashing • Ion implant • Implant anneal • Rapid thermal processing (RTP) Contact Us Greene, Tweed Semiconductor Kulpsville, PA, USA Statements and recommendations in this publication are based on our experience and knowledge of typical applications of this product and shall not constitute a guarantee of performance nor modify or alter our standard warranty applicable to such products. Prior to actual use it is recommended compatibility tests be run to determine suitability in a specific application. This is critical where failure could result in injury or damage. A regular program of inspection and replacement should be implemented. Greene, Tweed technical personnel are available to help with a recommendation. © 2005, Greene, Tweed all rights reserved All trademarks are property of their respective owners. 05/05-GT DS-US-SC-052 • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)