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General Silicones-Buffer material for bonding process

General Silicones-Buffer material for bonding process

Product catalog summary
Overview: This document provides the technical specifications for the product identified as GSG9701, with a part number GSG9710. The specifications cover various physical and mechanical properties tested using standard ASTM methods.
Specifications:
  • Color: White (Visual inspection)
  • Hardness: 36 Shore A (ASTM D2240)
  • Thickness: 0.35 mm (ASTM D374)
  • Specific Gravity: 1.08 (ASTM D792)
  • Tensile Strength: 47.44 Kgf/cm2 (ASTM D412)
  • Tear Strength: 22.28 Kgf/cm (ASTM D624)
  • Elongation: 389.2% (ASTM D412)
  • Thermal Impedance: 1.87℃ in2/W (ASTM D5470)
  • Thermal Conductivity: 0.14 W/m K (GS-Method)
  • Surface Resistivity: >1012 Ω (ASTM D257)
Key Observations: The product exhibits high surface resistivity, indicating excellent insulating properties. It also has significant elongation and tensile strength, suggesting good flexibility and durability. The thermal properties indicate moderate thermal conductivity and impedance, suitable for applications requiring thermal management.
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Catalog excerpts

General Silicones-Buffer material for bonding process-1

Test Method Specific gravity Tensile strength Tear strength Thermal Impedance Thermal conductivity Surface resistivity

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