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Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System

Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System

Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System

Product catalog summary
Overview: The document introduces the new generation J-series camera head, which offers a 2x field of view for the main camera, reducing inspection cycle time by up to 50%. It is optimized for Through-Hole Technology (THT) components and post-wave and selective soldering inspections.
Specifications: The system supports bottom-up and top-down inspection, allowing for PCB inspection from below a conveyor belt or chain and from above. It is compatible with solder fixtures and features a second-generation mechanical design with an optional 80mm Z-axis. The system can support up to 18 cameras, with options for 1 or 9 cameras per inspection side.
Inspection Capabilities: The SpectorBOX system offers modular inspection possibilities, allowing for bottom, top, or combined top and bottom inspections. It is designed to inspect PCBs inside solder frames directly from the conveyor system. The system is equipped with a Z-axis moving optical head for optimal focus and positioning, accommodating varying PCB and component distances or warpage.
Camera and Imaging: The main camera is a 4.8 MP CCD digital camera with USB 3 Vision, offering a field of view of 36x30mm and a resolution of 15µm. The system includes 8 side cameras with a 45/45-degree configuration. The lighting system features omnidirectional quad LED rings for side, main, and line-sourced DOAL lighting.
Software and Interfacing: The system includes post-defect classification and reporting scenarios, allowing for inline inspection and later classification, reporting, and analysis of defects. It supports general-purpose I/O for module control and offers interfacing options with third-party systems through USB3 Vision, CSV centroid files, and the Mek Catch System for repair, monitoring, and SPC.
Mechanical and Environmental Specifications: The system operates at a mains voltage of 100-240 Vac and consumes 150W. It functions within an operating temperature range of 15-30°C and humidity below 80% RH. The external dimensions are W900 x D1080 x H316 mm, and it weighs 100 kg.
Conclusion: The Mek SpectorBOX is a versatile and modular AOI system designed for efficient inspection of THT components and solder joints, offering advanced imaging capabilities and flexible integration options.
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Catalog excerpts

Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System-1

Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System  Now featuring the new generation J-series Camera Head  Optimized for THT Components- and Post Wave 2x field of view for main camera for up to 50% reduction of inspection cycle time, and Selective 3D for JTAz models AOI Solution for Wave & Selective Soldering of Through-Hole Components and Selective Soldering Inspections  Bottom-up and/or Top-down Inspection Inspects PCBs from below a Conveyer Belt or Chain and from above  Solder Fixture Compatible Designed to Inspect PCBs inside Soldering Fixtures directly from the conveyer  Second generation mechanical design Improving on the success of the SpectorBOX with optional 80mm Z-axis and accompanying drive systems  Modular Inspection Possibilities: Bottom, Top or Possibility to combine 2 SpectorBOX systems for simultaneous Top+Bottom AOI (optional)  Simple compatibility with integrators Multiple 3rd party Turn-key Solutions readily available. SpectorBOX Systems fit conveniently inside these main frames  Supports up to 18 Cameras (J series head) Choose between 1 or 9 camera's per inspection side (up to 18 cameras in Top+Bottom configuration)  Z-Axis Moving Optical Head(s) Focus and Position optimally for varying PCB & Component distances or warpage Contact closing I/O for Module control by existing PCB handling systems or PLC’s  Post Defect Classification and Reporting Inspect your PCBs Inline & Classify/Report/Analyze Defects later whenever convenient with our Catch system

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Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System-2

Bottom Up/Top Down Features The Mek SpectorBOX is a modular AOI system that can be used in two separate ways: Bottom-Up and Top-Down: Bottom Up: AOI is optimized for the inspection of THT solder joints and detection of solder bridges and solder balls. The Bottom Up SpectorBOX is configurable with one of three different optical units: JTz, JTAz and JDz. Top Down: AOI is optimized for the inspection of THT components to find any visual defect like presence/absence, wrong polarity, colour, type, bent pins etc. It has a top clearance of 130mm (5.12”) so inspection can be done even when the tallest...

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Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System-3

Line Sourced DOAL (Diffused On Axis Light (Coaxial)) Main Camera Side Camera 90° angle co-axial light (Prism white) 65° angle main light (Synthetic blue) 45° angle side light (Red ) Incoming light Reflected light Good Solder Good Solder Good Solder The combination of these three lights result in the fact that it can detect visual defects of THT solder joints and detect bridges and solder balls. Good Solder Histogram Analysis Algorithms: Algorithms for Solder Balls Detection: Algorithms for Solder Bridge Detection: - Condition based decision making - Tolerances can be set tightly - Minimized false...

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Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System-4

Specifications SpectorBOX Bottom Up Maximum PCB Size Product type Automatic Optical Inspector Camera movement X+Y+Z Direction Stationary during inspection, Transport designed by system integrator Parts inspection Soldering, Bridges, Solder Balls, Components Imaging principle Synthetic Imaging, Spectral Analysis, Greyscale limits Imaging parameters Brightness, Contrast, Hue, Saturation via Filters Specifications Main Camera type 4.8 MP CCD Digital with USB 3 Vision Main Camera FoV/Resolution Lens Telecentric lens with built in prism for DOAL Lighting Side cameras 8 side cameras CL/USB3 Vision...

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Mek SpectorBOX Bottom-Up and Top-Down Modular AOI System-5

Product type Automatic Optical Inspector Camera movement X+Y+Z Direction Stationary during inspection, Transport designed by system integrator Parts inspection Presence/Absence, Type, Polarity, Colour, Text, Offset Imaging principle Synthetic Imaging, Spectral Analysis, Greyscale limits Imaging parameters Brightness, Contrast, Hue, Saturation via Filters Specifications Main Camera type 4.8 MP CCD Digital with USB 3 Vision Main Camera FoV/Resolution Focal & Aperture Adjustable Macro Lens Side cameras 8 side cameras CL/USB3 Vision with Tilt-Shift custom lenses in 45/45 degree configuration Side...

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