Overview

The document presents detailed technical specifications and features of MEK BTL/BL Dual Side In-line Automated Optical Inspection (AOI) systems, designed for high-speed, high-accuracy inspection of printed circuit boards (PCBs) during various production stages.

Main Features

• Dual-Side or Bottom-Up Inspection: Full-featured inline inspection with synchronized top and bottom heads enabling parallel inspection cycles.
• High-Speed Cameras: Main camera operates at 60 frames per second (fps) with USB 3 Vision side cameras, eliminating the need for capture cards.
• Advanced Lighting System: Multi-color, multi-angle LED lighting including Line Source Coaxial Lighting and Meniscus Profiler for reliable solder joint and pad surface analysis.
• Comprehensive Inspection Capabilities: Detects SMT and THT components for presence, type, polarity, offset, text, color, height, coplanarity, solder paste, and soldering defects (post-reflow, wave, selective, manual).
• Flexible Classification and Reporting: Supports integration into existing factory layouts with customizable classification and reporting scenarios.
• Optical Head Adjustability: Height adjustable optical heads compensate for PCB warp and accommodate tall components and sandwich assemblies.
• Triple Use of Side Cameras: Side cameras serve for automatic inspection, classification, and repair processes.
• Prototype Mode: Enables quick programming for first-off inspection to verify production line setup before full production.

Hardware and Software Features

• Angular Side Sensors: Up to 8 multiplexed side view sensors with CameraLink interface, 45/45 degree arrangement, 50x magnification (10µm/pixel), full color, and auto highlight capabilities.
• Lighting and Optics: Line Sourced Direct On Axis Lighting (DOAL) with telecentric optics to avoid shadows from tall components and ensure accurate inspection modeling.
• Image Processing: Synthetic imaging and spectral analysis algorithms optimize defect detection while minimizing false rejects.
• Side View Lens Technology: Shift & Tilt lenses provide distortion-free side images across the entire field of view (FoV), maintaining consistent sensor distance.
• Field of View and Speed: Double-sized FoV enables up to twice faster inspection compared to previous generations, with square FoV and circular lighting allowing program rotation without debugging.
• Solder Inspection Algorithms: Dedicated algorithms for solder bridge and solder ball detection, histogram analysis with condition-based decisions, and tight tolerance settings to reduce false alarms.

Technical Specifications

PowerSpector JTAz + JDAz 350BTL and 550BTL Models

• Maximum PCB Size: 350x250mm (13.8"x9.8") and 550x550mm (21.6"x21.6") respectively.
• Inspection Type: In-line automatic optical inspection with stationary PCB during inspection.
• Camera System: Digital color USB Vision cameras at 60 fps, 36x30mm FoV with 15µm resolution, telecentric lens with built-in prism for DOAL lighting.
• Lighting: Omnidirectional triple LED rings (Side Red, Main, Line Sourced DOAL).
• Smallest Component Size: 01005" (0.4x0.2mm).
• Component Clearance: Top clearance 30mm (JTAz) or 60mm (JDAz), bottom clearance 30mm or 60mm accordingly.
• Z-Axis Movement: 30mm range for optical head adjustment.
• Side Cameras: 8x digital color USB 3.0 Vision cameras in 45/45 orientation.
• Inspection Speed: Typical capacity of 2750 parts per minute (ppm).
• Conveyor: Speed range 10-500mm/s, left-to-right configuration, height adjustable 830-950mm.
• PCB Clamping: Top justified with ruler blade, top & edge clamping, sensor stopper.
• Minimum Board Size: 50x50mm (2.0"x2.0").
• Board Thickness: 0.6-4mm (24-79 mils).
• Control PC: Apple Mac Mini or iMac x2.
• Interfaces: SMEMA for conveyor, USB and Thunderbolt for data, CSV centroid files for programming, optional Mek Catch System for repair/SPC/MES integration, and third-party MES interfacing via SQL DB/XML/Socket.
• Operating Conditions: Temperature 15-30°C (60-90°F), humidity 15-80% RH.
• Machine Dimensions and Weight: 350BTL: 878x916x1313mm, 240kg; 550BTL: 1078x1320x1317mm, 400kg.

PowerSpector JDz + JDz 350BTL and 550BTL Models

• Similar specifications to JTAz + JDAz models with the following differences:
• Side Cameras: Not available.
• Top Component Clearance: 40mm extendable to 60mm.

Applications and Benefits

• Inspection of SMT and THT components throughout all production stages including solder paste inspection, post-reflow, wave, selective, and manual soldering.
• Reliable detection of solder defects such as bridges, balls, insufficient or excess solder, and component misplacements.
• Adaptability to complex PCB assemblies including tall components and sandwich structures without additional jigs.
• High throughput and accuracy reduce false rejects and improve production yield.

Manufacturer and Contact Information

MEK Europe BV, Netherlands; MEK Americas LLC, USA; and Marantz Electronics, Japan are the manufacturers and distributors. Contact details and websites are provided for further inquiries.

Notes

Specifications and design are subject to change without notice.