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MBF200 Solid State Fingerprint Sensor data sheet

MBF200 Solid State Fingerprint Sensor data sheet

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MBF200 Solid State Fingerprint Sensor data sheet

Product catalog summary

Applications

Computer and network security
Portable and mobile device security
Access control for doors, locks, and safes
ID tokens and Smart Cards
Transportation and medical security
Finance: secure transactions

Package Overview

The Fujitsu MBF200 is a 500 DPI 8-bit grayscale solid-state capacitive fingerprint sensor. It features a 256 x 300 pixel array with a sensing area of 12.8mm x 15.0mm. The sensor uses a metal electrode and a finger as capacitor plates, with a passivation layer providing resistance. The capacitance is measured and converted into an 8-bit grayscale image.

Features

Rugged, high-resolution sensor with 500 DPI
Large image area and programmable gain
Compact LQFP package with USB, MCU, and SPI interfaces
Durable with ESD certification and wide operating temperature range
Integrated 8-bit ADC and auto finger-detection
Low power consumption

Technical Specifications

The sensor operates with a 256 x 300 sensor array, capturing fingerprint images one row at a time. The process involves pre-charging and discharging sensor plates, with the difference in voltages indicating capacitance. Sensitivity is adjustable via discharge current and time.

Interfaces and Modes

Microprocessor and SPI bus interfaces
USB interface with internal and external ROM options
Various register commands for SPI slave mode

Recommendations

Recommended solder reflow profile and parts handling
Guidelines for mechanical design and PCB orientation

Compliance

The MBF200 is RoHS compliant, ensuring reduced hazardous materials.

Specifications: The sensor requires specific power and ground connections for both analog and digital sections. Key pins include ISET for setting reference current, AIN for analog input, and FSET for frequency setting. The device supports multiple operational modes determined by MODE[1:0] pins.

Pin Descriptions: The document details the function of each pin, including power supply pins (VDDA1, VDDA2, VDD1, VDD2, VDD3), ground pins (VSSA1, VSSA2, VSS1, VSS2, VSS3), and various input/output pins for data and control signals. Special attention is given to pins like XTAL1 and XTAL2 for oscillator connections, and MOSI/MISO for SPI communication.

Operational Modes:

Microprocessor Bus Interface Mode: Utilizes pins like D[7:0], A0, RD, WR, CS0, CS1, EXTINT, INTR, and WAIT. It supports indexed addressing for function registers and disables SPI and USB interfaces.
SPI Slave Mode: Uses SCLK, SCS, MOSI, MISO, and EXTINT pins. It supports SPI modes (0,0) and (1,1) with data transfer rates up to 12 Mbits per second.
USB Interface Mode: Utilizes DP, DM, EXTINT, XTAL1, and XTAL2 pins. It requires a 12 MHz clock source and accesses internal USB descriptor ROM for communication.

Procedures: The document outlines procedures for reading and writing registers in SPI Slave Mode, including command sequences for Register Read and Write operations. It also describes USB endpoint configurations for control, bulk-in, and interrupt operations.

Recommendations: Specific resistor values are recommended for setting reference currents and frequencies (e.g., 200k ohm for ISET, 56k ohm for FSET). Proper connections and configurations are advised for different operational modes to ensure optimal performance.

USB Interface Mode: This mode utilizes specific pins (DP, DM, SCLK, SCS, MOSI, MISO, EXTINT, XTAL1, XTAL2) and requires a 12 MHz source for XTAL1. The internal USB descriptor ROM is disabled, allowing an external serial ROM to override it. The VDD and VDDA pins must be powered between 3.3V and 3.6V.

SPI Master Mode: Operates in SPI mode (1,1) with CPOL = 1 and CPHA = 1. SCK is limited to 1 MHz, with MOSI bits changing on the falling edge and MISO bits sampled on the rising edge.

Function Register Descriptions: Registers are accessed via indexed addressing. Key registers include RAH, RAL, CAL, REH, REL, CEL, DTR, DCR, CTRLA, CTRLB, CTRLC, SRA, PGC, ICR, ISR, THR, CIDH, CIDL, and TST. Each register has specific functions, such as controlling image capture, setting discharge times, and managing interrupts.

Control Registers:

CTRLA: Initiates image conversion and selects input sources for the A/D converter.
CTRLB: Manages A/D converter status and automatic finger detection.
CTRLC: Controls general output port pins P0 and P1.

Interrupt Control: The ICR register manages interrupt sources, enabling or disabling them, and setting their sensitivity and polarity.

Image Retrieval: The sensor must be enabled and image parameters adjusted before initiating GETIMG, GETROW, or GETSUB operations.

Image Capture Operations:

Get Row: Load the row address, initiate a GETROW operation via CTRLA, and read CTRLA 256 times to retrieve data.
Get Whole Image: Initiate with CTRLA, no pre-loading of row/column registers needed, and automatically starts A/D conversion.
Get Sub-Image: Load starting and ending addresses for rows and columns, initiate with CTRLA, and read until the sub-image is retrieved.

Interface Modes:

Microprocessor Mode: Uses specific register writes and reads for operations.
SPI Mode: Commands are sent via MOSI and data read via MISO, requiring separate commands for each row.
USB Mode: Operations initiated on endpoint 0, with image data read from endpoint 1.

Electrical Characteristics:

Absolute Maximum Ratings: Includes power supply voltage, output current, and storage temperature limits.
Operating Range: Specifies supply voltage and ambient temperature ranges.
DC Characteristics: Details input/output voltage levels and leakage currents for different VDD values.
Power Supply Consumption: Lists typical and maximum current consumption for various modes and conditions.

AC Characteristics:

Provides timing specifications for read and write cycles in microprocessor and SPI modes.

Physical and Mechanical Design:

Dimensions: Details the physical dimensions of the sensor package.
Recommended Land Pattern: Provides dimensions for PCB design.
Array Orientation: Specifies pin layout and sensor array coordinates.
Technical Recommendations: Includes solder reflow profiles, handling, and storage conditions.

Conclusion: The document serves as a comprehensive guide for integrating and operating the MBF200 sensor, emphasizing precise electrical and mechanical specifications to ensure optimal performance and reliability.

Technical Recommendations

Power and Ground Connections: To minimize image noise, connect VDDA1 and VDDA2 (analog power supply pins) with a bulk capacitor (4.7µF to 10µF) and two 0.1µF capacitors in parallel to ground. Separate these from digital power pins using a 10Ω resistor. For digital power pins (VDD1, VDD2, VDD3), place 0.1µF capacitors close to the pins. Input signals tied high should connect through a 1K to 10KΩ resistor for ESD protection.
Sensor PCB Orientation: Mount the MBF200 with pins 1-40 pointing away from the user and pins 41-80 towards the user. Ensure the sensor is flush with the surface for optimal finger contact. A groove or channel is recommended for proper finger positioning.

RoHS Compliance

The MBF200 sensor complies with RoHS standards, with no hazardous substances like asbestos, azo colorants, or ozone-depleting substances detected.

Revision History

2001 V.1.0: Initial Release
2004 V.1.1: Package specification and typo corrections
2005 V.1.2: Updates on cover page, lead-free classification, power consumption values, and addition of technical recommendations and RoHS compliance table
2005 V.1.3: Solder reflow profile update

Catalog excerpts

MBF200 Solid State Fingerprint Sensor data sheet-1

Computer access and network securityՕPortable device security Mobile fingerprint image capture ՕAccess control: doors, locks, and safes ID tokens and Smart Cards ՕTransportation security: vehicles, cargo Medical: HIPAA, patient records privacy ՕFinance: secure transactions, audit trail > The Fujitsu MBF200 is a 500 DPI 8-bit grayscale solid-state capacitive fingerprint sensor that reliably captures fingerprint images. The 2-dimensional array consists of 256 x 300 pixels manufactured in standard CMOS. The sensing area is 12.8mm x 15.0mm (0.5" x 0.6"). Each pixel is made up of a metal electrode, which acts as one plate of a capacitor. The contacting finger acts as the second capacitor plate. A passivation layer on the device surface forms the dielectric between these two plates and provides abrasion and chemical resistance. The fingerprint image is determined by measuring the capacitance at each pixel and converting that data into an 8-bit grayscale image. > Rugged, solid-state capacitive fingerprint sensorՕHigh resolution 500 DPI, 8-bit grayscale imager Large image area:Ֆ12.8mm x 15.0mm (0.5" x 0.6") 256 x 300 pixel array (50um pitch)֕Programmable gain adapts to different fingersSmall: 24mm x 24mm x 1.4mm LQFP package ՕInterfaces: USB1.1, 8-bit MCU, SPI Durable:ՖESD: FCC-B/CE certifiedOperating temperature: -20ְC to +85CЕIntegrated 8-bit analog-digital converterAuto finger-detection circuit ՕLow Power3.3V to 5.0V֖20mA active, <200A sleep, 20յA standby >

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MBF200 Solid State Fingerprint Sensor data sheet-6

Fujitsu Microelectronics America, Inc. 3 > Pin Number 1VDDA1PWRAnalog Power Supply2VSSA1GNDAnalog Ground 3ISETOSets Reference Current 4AINIAnalog Input 5FSETOSets Internal Multi-vibrator Frequency 6VSSA2GNDAnalog Ground 7VDDA2PWRAnalog Power Supply 8TESTITest Mode Enable 9P0O8mA4mAOutput Port 010P1O8mA4mAOutput Port 1 11D7I/O8mA4mAData Bit 7 12D6I/O8mA4mAData Bit 6 13D5I/O8mA4mAData Bit 5 14D4I/O8mAData Bit 4 15VSS1GNDDigital Ground 16VDD1PWRDigital Power Supply 17D3I/O8mA4mAData Bit 3 18D2I/O8mA4mAData Bit 2 19D1I/O8mA4mAData Bit 1 20D0I/O8mA4mAData Bit 0 21A0IAddress Input 22RD > Name Type...

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MBF200 Solid State Fingerprint Sensor data sheet-7

4 Fujitsu Microelectronics America, Inc. VDDA1, VDDA2 (Pins 1 and 7) > Power Supply to the analog section of the sensor. VDDA1 powers the array, row drivers, column receivers, A/D converter, and sample/hold amplifier. VDDA2 powers the multi-vibrator and bias circuits. VSSA1, VSSA2 (Pins 2 and 6) > Ground for the analog section of the sensor. VSSA1 is the ground return for the array, row drivers, column receivers, A/D converter, and sample hold amplifier. VSSA2 is the ground return for the multi-vibrator and bias circuits. VDD1, VDD2, VDD3 ( Pins 25, 16, and 39) > Power supply to the digital logic...

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MBF200 Solid State Fingerprint Sensor data sheet-8

Fujitsu Microelectronics America, Inc. 5 Read enable, active low. To read from the chip, drive RD > Write enable, active low. To write to the chip, drive WR > Chip select, active low. The CS0 > Chip select, active high. The CS1/SCLK pin has a weak latch that holds the pins state when not being driven. CS1/SCLK may be left unconnected in USB mode if not using an external serial ROM. The function of this pin depends on the MODE1 and MODE0 pins. > CS1/SCLK functions as an active-high chip select input. Drive CS1/SCLK high while CS0-/CSC- is low to select the chip. > CS1/SCLK functions as the slave...

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MBF200 Solid State Fingerprint Sensor data sheet-9

6 Fujitsu Microelectronics America, Inc. Wait output, active low. W > SPI Master Output/Slave input. The MOSI pin has a weak latch that holds the pins state when not being driven. MOSI may be left unconnected in MCU mode or USB mode if not using an external serial ROM. The function of this pin depends on the MODE1 and MODE0 pins. > MOSI functions as the slave serial input. > MOSI functions as the master serial data output to the slave serial ROM data input. Unlike standard SPI, MOSI is actively driven high and low when transmitting data and is high impedance when idle. Connect a pull-up resistor...

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MBF200 Solid State Fingerprint Sensor data sheet-10

Fujitsu Microelectronics America, Inc. 7 USB D- data line. Use 43 ohm series resistor. In MCU or SPI mode, either pull-up this pin with a resistor or tie it to ground. > Mode Select pins. MODE[1:0] select one of four operating modes. > Test Mode Enable. It is intended for factory use only. Connect this pin to VSS. > Unconnected pins. > MODE[1:0] 00bMicroprocessor Bus Mode01bSPI Bus Mode 10bUSB Mode, Using Internal ROM 11bUSB Mode, Using External ROM CS0 H X X X X De-selected High ImpedanceX L X X XDe-selected High ImpedanceL H X H H Standby High Impedance L H L L H Read Index Register Output...

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MBF200 Solid State Fingerprint Sensor data sheet-11

8 Fujitsu Microelectronics America, Inc. SPI (Slave) bus mode uses the following pins: SCLK, SCS > In SPI Slave Mode, the sensor can operate in either SPI mode (0, 0) where CPOL = 0 and CPHA = 0 or SPI mode (1, 1) where CPOL = 1 and CPHA = 1. The SPI Master may clock in commands and clock out data up to 12 Mbits per second. The SPI Master can write and read the registers of the sensor even when the internal 12 MHz multivibrator or XTAL1/XTAL2 oscillator is halted.MOSI bits are sampled on the rising edge of SCK ՕMISO bits change on the falling edge of SCK SCK can be idle in either a high or low...

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MBF200 Solid State Fingerprint Sensor data sheet-12

Fujitsu Microelectronics America, Inc. 9 > Index 0x00RAHRow Address, HighR/W0x01RALRow Address, LowR/W 0x02CALColumn Address, LowR/W 0x03REHRow Address End, HighR/W 0x04RELRow Address End, LowR/W 0x05CELColumn Address End, LowR/W 0x06DTRDischarge Time RegisterR/W 0x07DCRDischarge Current RegisterR/W 0x08CTRLAControl Register AR/W 0x09CTRLBControl Register BR/W0x0ACTRLCControl Register CR/W 0x0BSRAStatus Register AR0x0CPGCProgrammable Gain Control RegisterR/W 0x0DICRInterrupt Control RegisterR/W0x0EISRInterrupt Status RegisterR/W 0x0FTHRThreshold RegisterR/W 0x10CIDHChip Identification, HighR...

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MBF200 Solid State Fingerprint Sensor data sheet-13

10 > Fujitsu Microelectronics America, Inc. Bit Number [7:0] RA[7:0] Low eight bits of Row Address Register Bit Number [7:0] CA[7:0] Column Address Register Bit Number [7:1] - Reserved. Write 0 to these bits.0 REND[8] Most Significant Bit of Row Address Register Bit Number [7:0] REND[7:0] Low eight bits of Row Address Register Bit Number [7:0] CEND[7:0] Column Address Register > Bit Name Function Bit Name Function Bit Name Function Bit Name Function Bit Name Function >

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