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FCRAM (All Products Catalog)

FCRAM (All Products Catalog)
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FUJITSU SEMICONDUCTOR LIMITED Nomura Fudosan Shin-yokohama Bldg. 10-23, Shin-yokohama 2-Chome, Kohoku-ku Yokohama Kanagawa 222-0033, Japan For further information please contact: North and South America FUJITSU SEMICONDUCTOR AMERICA, INC. Asia Pacific FUJITSU SEMICONDUCTOR ASIA PTE. LTD. #05-08 New Tech Park 556741 Singapore h ttp://sg. fu jits u. com/semiconductor/ FUJITSU SEMICONDUCTOR EUROPE GmbH Plttlerstrasse 47, 63225 Langen, Germany FUJITSU SEMICONDUCTOR SHANGHAI CO., LTD. 30F, Kerry Parkslde, 1155 Fang Dlan Road, Pudong District, FUJITSU SEMICONDUCTOR KOREA LTD. 902 Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic of Korea FUJITSU SEMICONDUCTOR PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road, Tsimshatsui, Kowloon, Hong Kong Specifications are subject to change without notice. For further information please contact each office. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR device; FUJITSU SEMICONDUCTOR does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU SEMICONDUCTOR assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU SEMICONDUCTOR or any third party or does FUJITSU SEMICONDUCTOR warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU SEMICONDUCTOR assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1 ) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU SEMICONDUCTOR will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of overcurrent levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. © 2007-2012 FUJITSU SEMICONDUCTOR LIMITED Printed in Japan Edited: Sales Promotion Department FUJITSU SEMICONDUCTOR shaping tomorrow with you

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FCRAM provides great product values and cost solution for digital consumer electronics and mobile applications. The spread of Social Network Service (SNS) and cloud computing lead to dramatic change of our life style and business style. The data volume of digital media contents has become larger scale. In order to process the large data smoothly, high performance memories are required. On the other hand, low power consumption is a key factor for long battery life. FCRAM(Fast Cycle RAM) has challenged to deliver best balance between performance and power consumption for dedicated...

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Consumer FCRAM (Low Power SDRAM) Consumer FCRAM is a Low Power SDRAM suitable for digital consumer electronics that require high-speed processing of large-scale digital data such as video data or computer graphics data, limited power budget. Fujitsu provides Consumer FCRAM products in wafer form allowing FCRAM and SoC to be combined in a single package also known as SiP FCRAM Features Consumer FCRAM with 64-bit I/O features high data bandwidth, low power consumption and the world's first 125 "C operating temperature for standard DRAMs. ■ High Temperature Operation up to 125°C Maximum...

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Consumer FCRAM featuring 125°C-rated operation and x64-bit I/O is ideal for SiP. Fujitsu has accumulated a great deal of experience through more than 30 designs with a wide variety of SiP configurations. SiP stands for "System in Package"; a technology and a product containing different semiconductor devices, such as memory devices and SoC (System on Chip) in a single package. Two cases of memory system configuration mounted on PCB are shown below. Configuration (example) SiP resolves the following issues on miniaturization, low design risk with short TAT, and cost reduction. By minimizing...

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