200 mm Semi-/ Fully-automated Probe System Overview The new Cascade SUMMIT200 advanced probing system, is essential for collecting high-accuracy measurement data on single or volume wafers as fast as possible. Designed for R&D, device characterization and modelling or niche production applications, the SUMMIT200 enables precision electrical measurements over temperature for ultra-low noise, DC, RF, mmW and THz applications, with manual, semi-automatic, and now fully-automatic operation, for fastest time to accurate data. The next-generation probe system uses PureLine™ technology to achieve one of the lowest noise levels available on the market. Patented AttoGuard® and MicroChamber® technologies significantly improve lowleakage and low-capacitance measurements. A new advanced 200 mm fast stage, cassette handling up to 50 wafers, high throughput test features, and wide temperature range of -60°C to 300°C, provides everything needed for the scientist, R&D and test engineer, or production operator to get their job done fast. The SUMMIT200 supports Contact Intelligence™ – a unique technology which guarantees to make and hold wafer contact with constant high quality. A powerful combination of innovative system design and state of the art image processing provides an operator-independent solution to achieve highly-reliable measurement data at any time. With a wide range of applications, and upgrade paths to meet any future needs, the SUMMIT200 provides the most advanced 200 mm probe station platform for fast, highaccuracy and high-volume measurements for existing and future devices and IC’s Manual and Fully-auto Wafer Handling Auto DC Measurement Asssistant Auto RF Measurement Asssistant

Features / Benefits Measurement Accuracy • Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AttoGuard and next generation MicroChamber technologies • Minimize AC and spectral noise with effective shielding capability • Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal • Shortest signal path test integration for accurate, thermally stable, and low-error data collection • Automated wafer handling for up to 5x faster time to accurate data • Contact Intelligence enables unattended tests on small pads • Thermally...

MicroChamber Performance Electrical Integrated technologies ≥ 30 dB 3-20 GHz (typical) Spectral noise floor* ≤ -170 dBVrms/rtHz (≤ 1 MHz) Thermal ATT System AC noise** Typical results. Actual values depend on probe / test setup. Test setup uses triaxial thermal chuck, 50 Ω termination, high quality LNA, and DSA/DSO instrument. ** Test setup: Station power ON, Thermal system ON (40°C), MicroChamber closed, guard to shield shorted with triax adapter on chuck. Instrument setup: Time domain digital scope (DC to 1 GHz), 50 Ω input impedance, cable to chuck BNC connector. Measurement: Peak-Peak Noise...

Mechanical Performance (continued) Z Stage Theta Stage ± 2 μm (0.08 mils)* standard moves ± 3 μm (0.12 mils)* large moves Measured at edge of 200 mm chuck Platen System Platen Material Steel for magnetic positioners Mounting system Accessory compatibility Minimum of 8 DC or 4 RF positioners allowed, compatible simultaneous probe card holder use Integrated laminar-flow air-cooling for thermal expansion control Standard interface For MicroChamber, TopHat, probe card holders and custom adapters Platen Lift Type Precision 4-point linear lift Lift control Ergonomic handle with 90° stroke. Optional...

Platform (continued) Communication Ports Type Station Controller - Rear For security keys and USB instrument control Station Controller - Front Station Controller - Rear Station Controller - Rear Station Controller - Rear For instrument control (thermal, microscope, etc). Station Controller - Rear Supplied with USB adapter for test instrument control Probe card contact sense Accessory Interface Ports Contact Intelligence Technology* The SUMMIT200 provides the lab automation capabilities needed to make critical precision electrical measurements. With Contact Intelligence technology, SUMMIT200...

Wafer and AUX Chuck Wafer Chuck FemtoGuard Coax (high isolation) Coax (high isolation) Vacuum interface (495 Micro-holes, best for thin wafers) Diameter Thermal 200 mm (8 in.) Non-Thermal 200 mm (8 in.) Non-Thermal 150mm (6 in.) DUT sizes supported Shards or SEMI-M1 compliant wafers 50 mm (2 in.) through 200 mm (8 in.) Optional single-die accessory available. Vacuum zones Vacuum diameters*** Vacuum actuation Easy access multi-zone manual vacuum controls, and software control (semi-automated) Nickel (Ni) plated aluminum or Gold (Au) plated aluminum Patented MicroVac technology using 495 micro-hole...

Wafer Loader Test Automation Supported cassettes 25 wafers with 100 mm or 150 mm (SEMI E1) or 200 mm (SEMI E1 like)* Cassette stations Wafer handling Wafers in compliance with SEMI M1 Handling of non-SEMI M1 compliant (“thin”) wafers to be tested prior to quote, special solutions available Optical pre-aligner with flat/notch detection Translucent wafer materials require test prior to quote Wafer endeffector Vacuum horseshoe handling on wafer bottom side (in combination with pin chuck) Wafer topside handling with cyclon technology and edge touch Optional at top or bottom side (user changeable)...

V elox™ Probe Station Control Software The SUMMIT200 is equipped with Velox probe station control software. VeloxPro can be added optionally for SEMI E95 compliance and test executive capabilities. Operating system is Windows 10. Velox Probe Station Control Software Velox software provides all features and benefits required for semi- and fully-automated operation of the probe system, such as: • User-centered design: Minimized training costs and enhanced efficiency. • Windows 10 compatible: Highest performance and safe operation with state-of-the-art hardware. • Loader integration: No need for...