Summit 200 mm Manual and Semi-automated Probe Systems
15Pages

200 mm Manual and Semi-automated Probe Systems Overview Summit™ series manual and semi-automated probe systems, with PureLine™ and AttoGuard® technology, allow you to access the full range of your test instruments for 200 mm and 150 mm wafers. Whatever your application: RF/Microwave, device characterization, wafer level reliability, e-test, modeling, or yield enhancement, Summit series platforms lead the industry in on-wafer measurements. Summit series probe stations are easy to configure with your choice of measurement performance, manual or semi-automated operation, chuck size, thermal range and microscope options. All platforms are -60°C to 300°C compatible to ensure an upgrade path to meet your future needs. The powerful Velox™ probe station control software features easy on-screen navigation, wafer mapping, automation and seamless integration with analyzers and measurement software. It enables simple operation of motorized positioners and thermal systems. For a wide range of applications, the Summit probe station powered by Velox software achieves high test efficiency. Features / Benefits Measurement accuracy • Best solution for low-noise and 1/f measurements with advanced PureLine, AttoGuard and MicroChamber® technologies • Minimize AC and spectral noise with effective shielding capability Positioning accuracy • Precision 4-axis semi-automatic stage for accurate positioning with temperature compensation and automated XYZ and theta correction for enhanced positioning accuracy • Manual 3-axis stage enables fast, accurate “hands on” wafer positioning with ergonomic controls • Unattended testing over multiple temperatures with VueTrack™ technology and HighTemperature Stability (HTS) enhancement • eVue™ digital imaging system: enhanced optical visualization, fast set-up, in-die and wafer navigation • Powerful automation tools, such as automatic die-size measurements and wafer alignment • CellView enables fast sub-die navigation Flexibility and applicationtailored solutions • RF/microwave device characterization, 1/f, WLR, FA and design debug • Complete solution for small- and large-area multi-site probe cards • Seamless integration between Velox and analyzers/measurement software • Quick, safe, and comfortable wafer access via locking roll-out stage • “Hands-free” microscope remote control • Intuitive ergonomic controls, enable fast setup and test data gathering • Easy on-screen navigation, wafer mapping and operation of motorized

Note: For physical dimensions and facility requirements, refer to the Summit Facility Planning Guide. Mechanical Performance X-Y Travel Motion control 5 phase stepper motors and manual controls Manual controls (X-Y direct rotary knobs) Feedback system 1 μm resolution closed loop optical linear encoder Manual Fixed Z mount Theta Stage ± 2 μm (0.08 mils)* standard moves ± 3 μm (0.12 mils)* large moves * Measured at edge of 200 mm chuck System Move time (semi-automated) Probe-force capability Probe-force deflection ≤ 0.0015 μm/μm slope per 10 kg load System planarity ≤ 35 μm (1.3 mils) @ 25°C...

MicroChamber Electrical (Semi-automated) Spectral noise floor* * Typical results. Actual values depends on probe / test setup. Test setup uses triaxial thermal chuck, 50 Ω termination, high quality LNA, and DSA/DSO instrument. ** Test setup: Station power ON, Thermal system ON (40°C), MicroChamber closed, guard to shield shorted with triax adapter on chuck. Instrument setup: Time domain digital scope (DC to 1 GHz), 50 Ω input impedance, cable to chuck BNC connector. Measurement: Peak-Peak Noise Voltage (acquire 1000 data points, and calculate mean of Vp-p data). Light Shielding Type...

Wafer and Aux Chuck Design Wafer Chuck FemtoGuard Vacuum interface MicroVac ** (495 Micro-holes, best for thin wafers) Shards or wafers 50 mm (2 in.) through 200 mm (8 in.) Optional single-die accessory available. Vacuum zones Vacuum diameters *** Vacuum actuation Easy access multi-zone manual vacuum controls, and software control (semi-automated) Diameter Thermal 200 mm (8 in.) Non-Thermal 200 mm (8 in.) Non-Thermal 150mm (6 in.) * Nickel (Ni) plated aluminum or Gold (Au) plated aluminum ** Patented MicroVac technology using 495 micro-hole pattern for uniform vacuum hold down of thin,...

General System Specifications Communication Ports Type Station Controller - Rear For security keys and USB instrument control Station Controller - Front Station Controller - Rear Station Controller - Rear Station Controller - Rear Station Controller - Rear Station interconnect panel Probe card contact sense Station interconnect panel Control for switched GPIB (remote/local software control) Station interconnect panel Station interconnect panel Software ON/OFF control for microscope light Station interconnect panel Software ON/OFF control for auxiliary power For instrument control (thermal,...

Thermal Modular Chucks FemtoGuard Chuck Performance (200 mm) Thermal Chuck @ -60/-55°C Breakdown voltage Breakdown voltage Resistance (MicroVac / Hi-ISO) Resistance (Basic) Coaxial Chuck Performance (200 mm) System Electrical Performance Station with chuck (thermal) Summit M MicroVac / Hi-ISO Summit S MicroVac / Hi-ISO Probe leakage * Thermal controller OFF Thermal controller ON 300°C Capacitance variation ** Settling time *** Residual capacitance NOTE: Results measured with thermal chuck at standard probing height (5000 μm) with chuck in a dry environment. Moisture in the chuck may degrade...

Thermal System Performance Thermal System Overview Temperature ranges -55°C to 200°C, ATT, liquid cool (200 mm) -60°C to 300°C, ATT, air cool (200 mm) +20°C to 300°C, ATT, air cool (200 mm) +30°C to 300°C, ATT, air cool (200 mm) Wafer temperature accuracy High Accuracy 3 Thermal uniformity FemtoGuard, MicroVac, Hi-Iso ≤ ± 0.5C° @ 25°C, ≤ ± 1.5°C @ -60°C, ≤ ± 0.85°C @ 200°C, ≤ ± 1.5°C @ 300°C ≤ ± 0.5°C or ± 0.5% of measurement temp up to 200°C, (whichever is greater) 1. As measured with an Anritsu WE-11K-TSI-ANP or WE-12K-GW1-ANP type K thermocouple surface temperature measurement probe with...