PA200 BLUERAY 200 mm Semi-/ Fully-automated Probe System
6Pages

200 mm Semi-/ Fully-automated Probe System Overview The PA200 BlueRay™ sets a new standard for high-speed accuracy. Its precision ensures smooth probe landing with safe, repeatable electrical contact. In combination with the unique Z-profiling function, even extreme variation in height, such as the case with warped wafers, can be compensated. This test approach reduces pad damage and easily allows devices to be bonded after testing, even with the thinnest of pads. FormFactor recognizes that flexibility and modularity are the keys to addressing your production testing needs and we have created a solution that scales with your requirements. As the throughput demands increase, an optional waferhandling robot specifically designed for the PA200 BlueRay can be docked onto the prober. This upgrade to a fullyautomated system is done in the field. With the Velox™ probe station control software, the PA200 BlueRay enables easy on-screen navigation, wafer mapping, seamless integration with analyzers and measurement software, and simple operation of motorized positioners. The VeloxPro™ test automation software (optional) is an open architecture automation tool for fully-automated wafer probing. Compliant with SEMI E95, the VeloxPro easily enables automated wafer handling, cassette mapping, Z-profiling and stepping. The PA200 BlueRay, powered by Velox and VeloxPro, achieves easy test automation and high test throughput. Features / Benefits High throughput • Up to 20 dies/sec. (70,000 dies/hour) with MultiDie™ test technology • Eight positioning steps per second without compromising accuracy • Highest Z-axis resolution of any production prober Measurement accuracy • Wafer-handling robot can be docked onto prober • Easy integration and test automation using Velox and VeloxPro Cost effectiveness • Interfaces to all major analysis instrumentation, optics software and testers • Smallest footprint • Upgradeable in the field • Low cost of ownership, Fast return on investment • Scal

Power Handling (Chuck*) X-Y-Stage Travel Precision linear cross-roller Motor-drive system Feedback system Closed-loop optical linear encoder Theta Stage Travel Accuracy of standard moves *Measured at edge of 200mm chuck Physical Dimensions Station Platform Station dimensions (with table)* Platen-to-eyepieces (optional) Weight (with table) *See drawings for detailed dimensions

Physical Dimensions Station with Optional Robot Handler Station dimensions* *See drawings for detailed dimensions Platen System Lift range Lift repeatability Accessory compatibility Minimum of eight DC or four RF positioners allowed, compatible simultaneous probe card holder use Platen-to-chuck height Aluminum with steel inserts for magnetic, vacuum and bolt-down positioners available

Platform The PA200 BlueRay features the Velox probe station control software, and also can be equipped with VeloxPro user interface for test automation (optional). Velox Probe Station Control Software Velox software provides all features and benefits required for semi-automated operation of the probe system, such as: • WaferMap with Z-profiling, sub-die stepping, binning and other useful features • Configurable user interface and programmable buttons • Cleaning routines for probe cards and probe tips VeloxPro Test Automation Software (Optional) The PA200 BlueRay can be equipped with the...

Non-Thermal Chucks Diameter Material / Surface Stainless steel with micro-hole patterns for compatibility with RF devices and thin wafers 2 auxiliary locations for use with ISS, contact or cleaning substrate Single dies >4 mm, shards or wafers 50 mm (2 in.) through 200 mm (8 in.) Vacuum rings Vacuum-ring actuation Three zones, controlled by software Thermal Chucks Diameter Material/ Surface Nickel coated surface with grooved vacuum rings Optionally one or two isolated auxiliary locations for use with ISS, contact or cleaning substrate Shards or wafers 50 mm (2 in.) through 200 mm (8 in.)...

Wafer-handling Robot (Option) Supported cassettes One SEMI E1 cassette (“H” bar design) Supported wafers 2”– 4”, 3”– 8” depending on robot configuration Substrate handling Vacuum horseshoe end effector at substrate bottom side Cassette indexing Single beam laser reflection scanner Optical sensing, compatible with notch / flats Scan time Load time (including pre-alignment) Station Accessories Measurement shelf Two places for instruments each 350 mm (W) x 380 mm (D) (13.8 in. x 15.0 in.), 30kg supporting weight Dark enclosure EMI shielding, light tight enclosure SE1000 (not with robot module)...