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Segment-, miniature- and high capacity cooling aggregates

Segment-, miniature- and high capacity cooling aggregates

Segment-, miniature- and high capacity cooling aggregates

Product catalog summary
Overview: The document provides detailed information on various cooling aggregates and components designed for effective heat dissipation in electronic devices. It highlights different types of cooling solutions, their specifications, and customization options available for specific applications.
Heatsink Cooling Aggregates: These are designed for effective heat dissipation of high-capacity transistors. They offer very good thermal efficiency when used with powerful axial fans. The heatsink profiles and fans are mounted using stable endplates, and these aggregates can be customized according to customer drawings.
Segment Cooling Aggregates: These consist of modular assemblies with different circle and length segments. They provide electrical and thermal isolation of individual cooling sections and are available with standard drilling patterns. The segment profiles can also be sold by the meter, and other fan types and voltages are available upon request.
Miniature Cooling Aggregates: These are compact solutions for dissipating high power losses in small spaces. They feature heatsink geometries and fixed lengths optimized for the fan used, ensuring homogeneous heat dissipation. Mounting options include sliding nut channels or specific snap-to-retaining springs for transistors.
Hollow Fin Cooling Aggregate: This type features a flow-optimized hollow fin geometry with precise milled flat semiconductor mounting surfaces. It offers laminar airflow and noise reduction through harmonized chamber systems and can be customized according to customer specifications.
High Capacity Cooling Aggregates: Designed exclusively for forced convection, these aggregates are suitable for radial and tangential fans. They feature a flow-optimized design with thick bottom plates for best heat dissipation and precise milled flat semiconductor mounting surfaces. Custom mechanical treatments and surface coatings are available.
Lamella Cooling Aggregates: These provide high power density with large heat exchanging surfaces and thick multi-wall sheets for optimal heat dissipation. They are made of specially formed aluminum lamella structures and are available with or without airflow chamber systems.
Customer Specific Treatments: The document outlines various mechanical treatment possibilities such as cutting, milling, drilling, threading, and deburring. Adhesive protection foils are used to prevent scratching of milled surfaces, and assembly and packaging can be customized upon request.
Contact Information: The document provides contact details for Fischer Elektronik GmbH & Co. KG, including their address, phone, fax, and email for further inquiries or orders.
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Catalog excerpts

Segment-, miniature- and high capacity cooling aggregates-1

to cool to protect to connect S e g me n t - , m i n ia t u re - and high capacity co o ling ag g re g at e s

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Segment-, miniature- and high capacity cooling aggregates-2

Strangkühlkörper Transistorhaltefedern LED-Kühlkörper Lamellenkühlkörper Segment cooling aggregates Miniature cooling aggregates Heatsink cooling aggregates Hollow fin cooling aggregate Segment cooling aggregates – modular assembly consisting of different circle- and length segments – electrical and thermal isolation of the single cooling segment sections – standard drilling patterns TO 3 and pressfit – segment profile also sold by the meter – other fan types and fan voltages upon request Miniature cooling aggregates – compact construction for dissipating high power losses on smallest installation...

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Segment-, miniature- and high capacity cooling aggregates-3

Lamella cooling aggregates High capacity cooling aggregates High capacity heatsinks Customer specific treatments Lamella cooling aggregates – high power density by big heat exchanging surfaces, thick multi-wall sheets for best heat dissipation – special formed lamella structures made of aluminium for maximum heat flow – compact design, very low flow loss – available with or without airflow chamber systems – special solutions according to your demand High capacity cooling aggregates – very good thermal efficiency – flow-optimized design with radial fans – radial fans up to 1310 m³/h – precise...

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Segment-, miniature- and high capacity cooling aggregates-4

Please send us: Catalogue f.cool Extruded heatsinks LED-heatsinks Cooling aggregates Thermally conductive material +49 23 51 4 57 54 Company: Attn.: Dept.: Street: Post code/city: Catalogue f.case Cases 19“ Technology Test equipment Phone: Fax: E-mail: Please also send data to following place: other company: same company to the attention of: Catalogue f.con Sockets Connectors Brackets No, thank you. We do not have any need for your data. Please remove us from your mailing list. We thank you for helping us to avoid waste. Slip case f.collect for collecting Fischer catalogues to cool to protect...

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