Product Flyer FineXT 6003

Product catalog summary

Overview: The FineXT 6003 is a large area multi-chip bonder designed for speed and precision in production. It offers a placement accuracy of 3 µm and supports multi-chip and multi-wafer capabilities. The machine's modular platform allows for in-field retrofitting throughout its service life.

Key Features:

Automatic placement accuracy calibration and material management.
In-line capability with automatic substrate transport system.
Very large bond area suitable for wafers and panels.

Applications: The machine supports a wide range of applications including sintering, thermocompression bonding, soldering, adhesive bonding, and various assembly processes such as optical sub-assembly, high-power laser module assembly, and RF/HF module assembly.

Technologies: It integrates multiple bonding technologies within one system, offering flexibility for diverse projects. Technologies include adhesive, soldering, thermocompression, and ultrasonic bonding.

Modules & Options: The system offers numerous modules such as an automatic dipping unit, tool changer, chip heating module, and UV curing module, among others, to tailor solutions to specific application requirements.

Accuracy and Modularity: Finetech emphasizes a transparent and verifiable method for measuring placement accuracy. The modularity of the system supports a wide range of applications and allows for easy adaptation to new tasks, ensuring long-term investment protection.

Customer Feedback: Customers like Silitronics have successfully used the FineXT 6003 for complex applications, co-developing new assembly processes and enhancing state-of-the-art technologies.

Catalog excerpts

Large Area Multi-Chip Bonder Speed and Precision in Production Placement accuracy of 3 µm Very large bond area for wafers and panels In-line capability with automatic substrate transport system Automatic placement accuracy calibration Multi-chip capability Multi wafer capability Modular machine platform allows in-field retrofitting during entire service life Automatic tool management Fully automatic material management

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Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) Real flexibility by combining various technologies within one system to work on diverse projects Various bonding technologies in one recipe Real flexibility to implement new technology approaches Excellent contrast values with different materials for best visibility and recognition Data/media logging and reporting function Comprehensive process documentation and traceability of process parameters for analysis. Full process access & easy visual programming with touch screen interface Fast composition of process...

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Modules & Options » Automatic Dipping Unit » Automatic Tool Changer » Chip Heating Module » Component Presentation » Die Eject Module with Carousel » Die Flip Module » Dispense Module » Flexible Die Presentation » Formic Acid Module » Handling Module » Height Sensor (Laser) » I/O Lift System Automatic Tool Changer » I/O Panel Handling System » ID Code Reader » Manual Dipping Unit » Process Gas Module » Process Gas Selection » Programmable Wafer Changer with Cassette Lift » Substrate Heating Module » Substrate Support » UV Curing Module » Wafer Heating Module » Wafer Changer » Wafer Table Dispense...

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How We Understand Accuracy For assembly systems in packaging technology, socalled die bonders, the specified placement accuracy is an essential key figure for classification. However, it is often not clear which accuracy is meant and how or when it is measured. Therefore, Finetech relies on a transparent and verifiable method description of how the accuracy of our placement and assembly systems is measured and specified. This technical paper explains the context as well as the influencing factors of accuracy and shows which conclusions the customers can draw for themselves from the specified...

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Product Flyer FineXT 6003

Product Flyer FineXT 6003

Catalog excerpts

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