Large Area Multi-Chip Bonder Speed and Precision in Production Placement accuracy of 3 µm Very large bond area for wafers and panels In-line capability with automatic substrate transport system Automatic placement accuracy calibration Multi-chip capability Multi wafer capability Modular machine platform allows in-field retrofitting during entire service life Automatic tool management Fully automatic material management

Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) Real flexibility by combining various technologies within one system to work on diverse projects Various bonding technologies in one recipe Real flexibility to implement new technology approaches Excellent contrast values with different materials for best visibility and recognition Data/media logging and reporting function Comprehensive process documentation and traceability of process parameters for analysis. Full process access & easy visual programming with touch screen interface Fast composition of process...

Modules & Options » Automatic Dipping Unit » Automatic Tool Changer » Chip Heating Module » Component Presentation » Die Eject Module with Carousel » Die Flip Module » Dispense Module » Flexible Die Presentation » Formic Acid Module » Handling Module » Height Sensor (Laser) » I/O Lift System Automatic Tool Changer » I/O Panel Handling System » ID Code Reader » Manual Dipping Unit » Process Gas Module » Process Gas Selection » Programmable Wafer Changer with Cassette Lift » Substrate Heating Module » Substrate Support » UV Curing Module » Wafer Heating Module » Wafer Changer » Wafer Table Dispense...

How We Understand Accuracy For assembly systems in packaging technology, socalled die bonders, the specified placement accuracy is an essential key figure for classification. However, it is often not clear which accuracy is meant and how or when it is measured. Therefore, Finetech relies on a transparent and verifiable method description of how the accuracy of our placement and assembly systems is measured and specified. This technical paper explains the context as well as the influencing factors of accuracy and shows which conclusions the customers can draw for themselves from the specified...