FINEPLACER® sigma Advanced Sub-Micron Bonder Unrivaled Flexibility for Research & Prototyping Reproducible sub-micron placement accuracy Pattern recognition for software verified alignment Large bonding area Wide range of supported component sizes UHD vision alignment system with FPXvisionTM Synchronized control of all process related parameters Modular machine platform allows in-field retrofitting during entire service life Wide range of component presentation (wafer, waffle pack, gel-pak®)

Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) Real flexibility by combining various technologies within one system to work on diverse projects In-situ process observation in HD Immediate visual process feedback for fast and easy process quality verification Excellent contrast values with different materials for best visibility and recognition Data/media logging and reporting function Comprehensive process documentation and traceability of process parameters for analysis Full process access & easy visual programming with touch screen interface Fast composition...

Modules & Options » Bonding Force Module (automatic) » Chip Heating Module » Component Presentation » Die Eject Module » Die Flip Module » Direct Component Printing Module » Dispense Module » Formic Acid Module » Manual Dipping Unit » Mask Generator "Scaled" Dispense Module Vacuum Chamber Module » Motorized Z Table » Process Gas Module » Process Gas Selection » Process Video Module » Substrate Heating Module » Substrate Support » Tool Tip Changer » Ultrasonic Module » UV Curing Module » Vacuum Chamber Module Chip Heating Module

How We Understand Accuracy For assembly systems in packaging technology, socalled die bonders, the specified placement accuracy is an essential key figure for classification. However, it is often not clear which accuracy is meant and how or when it is measured. Therefore, Finetech relies on a transparent and verifiable method description of how the accuracy of our placement and assembly systems is measured and specified. This technical paper explains the context as well as the influencing factors of accuracy and shows which conclusions the customers can draw for themselves from the specified...