Product Flyer FINEPLACER® pico 2

Product catalog summary

Overview: The FINEPLACER® pico is a versatile multi-purpose bonder designed for lab and research applications. It supports various bonding technologies such as adhesive, soldering, ultrasonic, and thermocompression, including reflow soldering. The machine offers full process access, easy programming, and supports a wide range of component sizes. Its modular platform allows for in-field retrofitting throughout its service life, available in manual or semi-automatic versions.

Key Features and Benefits:

Full process access with a touch screen interface for easy visual programming.
Individual configurations with process modules and sequence control with predefined parameters.
Compatibility of process modules across Finetech platforms.
Overlay vision alignment system for precise visual alignment.
Comprehensive process documentation and traceability.
Freely configurable RGB LED illumination for excellent visibility and user-friendly alignment.

Applications: The FINEPLACER® pico is suitable for a wide range of applications including sintering, thermocompression bonding, ultrasonic bonding, soldering, adhesive bonding, and various assembly processes such as X-Ray detector, inkjet print head, RFID module, and more.

Modules and Options: The machine offers numerous modules and options such as Gap Adjustment Module, Bonding Force Module, Camera Y-Shift Module, Chip Heating Module, Dispense Module, Process Gas Module, and UV Curing Module, among others.

Customer Feedback: Customers like Silitronics have successfully used the FINEPLACER® for complex applications, co-developing new assembly processes and enhancing state-of-the-art technologies. The machine's flexibility and modularity support a wide range of applications and ensure long-term investment protection.

Seamless Process Transfer: Finetech's "Prototype-to-Production" approach ensures seamless process transfer from R&D to production, maintaining technological freedom and minimizing financial risks.

Catalog excerpts

FINEPLACER® pico Multi-Purpose Bonder The Most Powerful Tool for Lab & Research Numerous bonding technologies (adhesive, soldering, ultrasonic, thermocompression), including reflow soldering Full process access and easy programming Wide range of supported component sizes In-situ process observation in HD Modular machine platform allows in-field retrofitting during entire service life Manual or semi-automatic machine versions Large bonding area Excellent price performance ratio

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Overlay vision alignment system (VAS) with fixed beam splitter Precise visual alignment of chip and substrate Freely configurable RGB LED illumination for alignment For excellent visibility of structures and the most user-friendly alignment procedure of all table top bonders Data/media logging and reporting function Comprehensive process documentation and traceability of process parameters for analysis Full process access & easy visual programming with touch screen interface Fast composition of process sequences and intuitive process implementation Process module compatibility across Finetech...

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Modules & Options » Gap Adjustment Module » Component Presentation » Bonding Force Module (automatic) » Bonding Force Module (manual) » Camera Y-Shift Module » Chip Heating Module » Direct Component Printing Module » Dispense Module » Form Generator » Formic Acid Module Process Video Module Dispense Module » Manual Dipping Unit » Optics Shifting » Process Gas Selection » Process Gas Module » Process Video Module » Substrate Support » Substrate Heating Module » Tool Tip Changer » Ultrasonic Module » UV Curing Module

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Seamless Process Transfer from R&D to Production How many of your promising product ideas got lost on the way from development to series production? Could you not follow through because of your die bonder's technological restrictions or the uncertain return on invest? Did you get stuck trying to automate your prototyping processes according to production requirements? With Finetech's "Prototype-to-Production" approach, you ensure 1:1 process transfer from R&D to production while maintaining full technological freedom, allowing for short timeto-market with minimized financial risks. Download the...

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Product Flyer FINEPLACER® pico 2

Product Flyer FINEPLACER® pico 2

Catalog excerpts

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