FINEPLACER® lambda Sub-Micron Bonder The Ultimate Tool for Opto Assemblies Sub-micron placement accuracy Superior optical resolution Excellent price-performance ratio Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) Data / media logging and reporting function Full process access & easy visual programming with touch screen interface Wide range of controlled bonding forces Manual or semi-automatic machine versions Individual configurations with process modules

Various bonding technologies in one recipe Real flexibility to implement new technology approaches Unique FINEPLACER® working principle Simply accurate component placement. Low maintenance technology ensures highest reliability in operation Overlay vision alignment system (VAS) with fixed beam splitter Precise visual alignment of chip and substrate In-situ process observation in HD Immediate visual process feedback for fast and easy process quality verification Synchronized control of all process related parameters Maximum process control and reproducibility Modular machine platform allows in-field...

Modules & Options » Bonding Force Module (automatic) » Bonding Force Module (manual) » Camera Y-Shift Module » Chip Heating Module » Component Presentation » Die Flip Module » Dispense Module » Dual-Camera Optics » Formic Acid Module » Form Generator » Gap Adjustment Module Process Video Module Dispense Module » High resolution optic » Manual Dipping Unit » Process Gas Module » Process Gas Selection » Process Video Module » Substrate Heating Module » Substrate Support » Tool Tip Changer » Ultrasonic Module » UV Curing Module

Seamless Process Transfer from R&D to Production How many of your promising product ideas got lost on the way from development to series production? Could you not follow through because of your die bonder's technological restrictions or the uncertain return on invest? Did you get stuck trying to automate your prototyping processes according to production requirements? With Finetech's "Prototype-to-Production" approach, you ensure 1:1 process transfer from R&D to production while maintaining full technological freedom, allowing for short time-to-market with minimized financial risks. Download...