Product Flyer FINEPLACER® femto pro

Product catalog summary

Overview: The document provides detailed information about the Automatic Multi-Purpose Bonder by Finetech GmbH & Co. KG, highlighting its capabilities, applications, and technical specifications. It emphasizes the bonder's precision, flexibility, and adaptability for advanced packaging solutions.

Specifications: The bonder offers a placement accuracy of 2 µm at 3 Sigma and supports ultra-low bonding forces. It features a modular machine platform that allows for in-field retrofitting, a large bonding area, and numerous bonding technologies including adhesive, soldering, ultrasonic, and thermocompression.

Features and Benefits: Key features include automatic placement accuracy calibration, multi-chip capability, and a wide range of controlled bonding forces. The system provides excellent contrast values with 3-color LED illumination for best visibility and recognition. It supports various bonding technologies and offers synchronized control of all process-related parameters for maximum process control and reproducibility.

Applications: The bonder is suitable for a wide range of applications such as laser diode assembly, optical sub-assembly, MEMS assembly, micro optics assembly, and various sensor assemblies. It supports advanced packaging techniques like wafer level packaging, 2.5D and 3D IC packaging, and multi-chip packaging.

Modules and Options: The system includes various modules and options such as an automatic dipping unit, chip heating module, die eject module, and ultrasonic module. These modules enhance the system's flexibility and allow for easy adaptation to new tasks.

Customer Feedback: The document includes a testimonial from Dhiraj Bora, CEO & President of Silitronics, praising the bonder's capability to support complex applications and co-development of new assembly processes.

Conclusion: The FINEPLACER® femto pro is presented as a versatile and efficient solution for advanced packaging, offering high accuracy, process flexibility, and a comprehensive range of applications. Its modularity and adaptability ensure long-term investment protection and the ability to meet evolving technological needs.

Catalog excerpts

Automatic Multi-Purpose Bonder The Efficient Solution for Advanced Packaging Multi-chip capability Numerous bonding technologies (adhesive, soldering, ultrasonic, thermocompression) Wide range of controlled bonding forces Modular machine platform allows in-field retrofitting during entire service life Wide range of component presentation (wafer, waffle pack, gel-pak®) Automatic placement accuracy calibration Large bonding area Placement accuracy of 2 µm @ 3 Sigma Ultra low bonding force

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Various bonding technologies in one recipe Real flexibility to implement new technology approaches Wide range of supported component sizes One bonding plattform supports a broad spectrum of applications Overlay vision alignment system (VAS) with fixed beam splitter Precise visual alignment of chip and substrate In-situ process observation in HD Immediate visual process feedback for fast and easy process quality verification Full process access and easy programming Flexible and intuitive process composition allows implementing complex applications with little training effort Data/media logging...

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Modules & Options » ID Code Reader » Laser Activation Module » Laser Bottom Heater » Lifting Door » Manual Dipping Unit » Optics Shifting » Process Gas Module » Process Gas Selection » Substrate Heating Module » Substrate Support » Ultrasonic Module » UV Curing Module » Automatic Dipping Unit » Automatic Tool Changer » Chip Heating Module » Component Presentation » Die Eject Module » Die Flip Module » Dispense Module » Flip Chip Test Module » Formic Acid Module » Handling Module » HEPA-Filter » Height Sensor (Laser) Multiple process cams for quick process development and detailed observation....

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How We Understand Accuracy For assembly systems in packaging technology, socalled die bonders, the specified placement accuracy is an essential key figure for classification. However, it is often not clear which accuracy is meant and how or when it is measured. Therefore, Finetech relies on a transparent and verifiable method description of how the accuracy of our placement and assembly systems is measured and specified. This technical paper explains the context as well as the influencing factors of accuracy and shows which conclusions the customers can draw for themselves from the specified...

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Product Flyer FINEPLACER® femto pro

Product Flyer FINEPLACER® femto pro

Catalog excerpts

All Finetech catalogs and technical brochures