Automatic Multi-Purpose Bonder The Efficient Solution for Advanced Packaging Multi-chip capability Numerous bonding technologies (adhesive, soldering, ultrasonic, thermocompression) Wide range of controlled bonding forces Modular machine platform allows in-field retrofitting during entire service life Wide range of component presentation (wafer, waffle pack, gel-pak®) Automatic placement accuracy calibration Large bonding area Placement accuracy of 2 µm @ 3 Sigma Ultra low bonding force

Various bonding technologies in one recipe Real flexibility to implement new technology approaches Wide range of supported component sizes One bonding plattform supports a broad spectrum of applications Overlay vision alignment system (VAS) with fixed beam splitter Precise visual alignment of chip and substrate In-situ process observation in HD Immediate visual process feedback for fast and easy process quality verification Full process access and easy programming Flexible and intuitive process composition allows implementing complex applications with little training effort Data/media logging...

Modules & Options » ID Code Reader » Laser Activation Module » Laser Bottom Heater » Lifting Door » Manual Dipping Unit » Optics Shifting » Process Gas Module » Process Gas Selection » Substrate Heating Module » Substrate Support » Ultrasonic Module » UV Curing Module » Automatic Dipping Unit » Automatic Tool Changer » Chip Heating Module » Component Presentation » Die Eject Module » Die Flip Module » Dispense Module » Flip Chip Test Module » Formic Acid Module » Handling Module » HEPA-Filter » Height Sensor (Laser) Multiple process cams for quick process development and detailed observation....

How We Understand Accuracy For assembly systems in packaging technology, socalled die bonders, the specified placement accuracy is an essential key figure for classification. However, it is often not clear which accuracy is meant and how or when it is measured. Therefore, Finetech relies on a transparent and verifiable method description of how the accuracy of our placement and assembly systems is measured and specified. This technical paper explains the context as well as the influencing factors of accuracy and shows which conclusions the customers can draw for themselves from the specified...