Advanced Sub-Micron Bonder Unrivaled Flexibility for Prototyping & Production Placement accuracy of 0.3 µm @ 3 Sigma on small to large substrates Automatic placement accuracy calibration Wide range of controlled bonding forces UHD vision alignment system with FPXvisionTM Multi-chip capability Wide range of component presentation (wafer, waffle pack, gel-pak®) Safe and controlled process environment with cleanroom quality Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic) Ultra low bonding force Modular machine platform allows in-field retrofitting during entire service life Large bonding area

Various bonding technologies in one recipe Real flexibility to implement new technology approaches Wide range of supported component sizes One bonding plattform supports a broad spectrum of applications. In-situ process observation in HD Immediate visual process feedback for fast and easy process quality verification Excellent contrast values with different materials for best visibility and recognition Data / media logging and reporting function Comprehensive process documentation and traceability of process parameters for analysis Full process access & easy visual programming with touch screen...

Modules & Options » Automatic Dipping Unit » Automatic Tool Changer » Bonding Force Module (automatic) » Chip Heating Module » Component Presentation » Die Eject Module » Die Flip Module » Dispense Module » Flip Chip Test Module » Formic Acid Module » Handling Module » Height Sensor (Laser) » ID Code Reader Live process observation Substrate Heating Module » Laser Activation Module » Laser Bottom Heater » Manual Dipping Unit » Motorized Nick & Roll Motion » Process Gas Module » Process Gas Selection » Substrate Heating Module » Substrate Support » Ultrasonic Module » UV Curing Module » Vacuum...

How We Understand Accuracy For assembly systems in packaging technology, socalled die bonders, the specified placement accuracy is an essential key figure for classification. However, it is often not clear which accuracy is meant and how or when it is measured. Therefore, Finetech relies on a transparent and verifiable method description of how the accuracy of our placement and assembly systems is measured and specified. This technical paper explains the context as well as the influencing factors of accuracy and shows which conclusions the customers can draw for themselves from the specified...