CL2000
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Adaptable Die Bonder Platform micro assembly machines

CL2000 Adaptable Die Bonder Platform The CL2000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market. It can be configured to a wide range of tasks in a wide range of production environments. The base system provides everything needed for a tremendous range of applications. A pre-configured high precision gantry motion system carries the tools for die bonding or testing. Of course the machine is designed for industrial production environments. In combination with a selection of a variety of functional modules the system becomes your...

Material Handling Laser Soldering Fast soldering process for chips E.g. COS (Chip on Submount) Fiber coupled light delivery Laser Class 1 operation Conduction heating by heating plates For soldering processes or thermal curing applications Flexible temperature PID control of heating profile Up to 450°C Different oven sizes available Co-planarity Unit For highest performance of chip to substrate parallelism Especially suited for larger dies Metrology for displacement Actuation for correction of bond line uniformity Tool Changer Magazine • For the automatic change of handling tools • Tool...

What we do ficonTEC designs and produces automated production equipment for the assembling or testing of components. We are the market leader in the field of equipment for the assembly or test of micro-optics or opto-electronics such as laser diode manufacture, medical technology, security and military engineering, as well as telecommunications. Contact us EUROPE ficonTEC Service GmbH, Rehland 8, 28832 Achim, Germany Phone: +49 4202 51160-0, Fax: +49 4202 51160-090 Mail: info@ficontec.com USA ficonTEC (USA) Corporation, 25 Calle Canela, San Clemente, CA 92673, USA Phone: +1 949 388-5800,...