CL2000
CL2000
The CL2000 is an adaptable die bonder platform designed for high precision die attach applications, particularly in the semiconductor and photonics packaging markets. It features a specialized bond head and die handler for optimal chip bonding accuracy.
Specifications
- Bonding Accuracy: +/- 2 microns
- XY Motors: Linear motors with glass scales encoders
- Lateral Travel: 450 mm x 450 mm x 100 mm (XYZ)
- Lateral Resolution: 100 nm
- Θ Travel: 270°
- Θ Resolution: 10 arcsec
- Force Control: 0 g to 250 g (optional up to 2000 g)
- Vision System: Edge detection, pattern match, shape match
- Lighting: Programmable intensity, ring or coaxial
- Eutectic Bonding: Up to 450°C
- Clean Room Compliance: ISO 6
Key Features
- High precision 4 axes motion system
- Industry-grade machine enclosure, Laser Class 1
- Linear motor-driven granite gantry
- Epoxy or Eutectic bonding
- Process Control Master software
Software and Control
- Remote service and control via the internet
- Freely programmable machine processes
- SQL database for process parameters and component data
- Component tracking and flexible data import/export
Modules and Units
- Material Handling: Cassette-to-Cassette, In-Line, Conveyor, etc.
- Laser Soldering: Fast soldering process for chips
- Heating Plates: Up to 450°C with flexible temperature control
- Co-planarity Unit: Ensures chip to substrate parallelism
- Tool Changer Magazine: Automatic tool change
- Wafer Processing: For up to 200 mm wafers
- Flip Chip Unit: For flipping chips during assembly
- Dispensing Unit: For dispensing epoxies
- UV Curing Unit: For curing UV epoxies
- Bonding Force Control: Closed-loop control for delicate components
Applications
- Si-Photonics components
- Sensor assemblies
- Medical devices
- MEMS/MOEMS
- Miniature lasers
- Hybrid assemblies
- LED print heads
- High power LEDs
Certifications
fi conTEC Service GmbH is ISO 9001:2008 certified.
Contact Information
Europe: fi conTEC Service GmbH, Germany
USA: fi conTEC (USA) Corporation, California
Asia: fi conTEC Trading (Shanghai) Limited Company, China
For more information, visit www.ficontec.com.
Catalog excerpts
Adaptable Die Bonder Platform micro assembly machines
Open the catalog to page 1
CL2000 Adaptable Die Bonder Platform The CL2000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market. It can be configured to a wide range of tasks in a wide range of production environments. The base system provides everything needed for a tremendous range of applications. A pre-configured high precision gantry motion system carries the tools for die bonding or testing. Of course the machine is designed for industrial production environments. In combination with a selection of a variety of functional modules the system becomes your individual...
Open the catalog to page 2
Material Handling Laser Soldering Fast soldering process for chips E.g. COS (Chip on Submount) Fiber coupled light delivery Laser Class 1 operation Conduction heating by heating plates For soldering processes or thermal curing applications Flexible temperature PID control of heating profile Up to 450°C Different oven sizes available Co-planarity Unit For highest performance of chip to substrate parallelism Especially suited for larger dies Metrology for displacement Actuation for correction of bond line uniformity Tool Changer Magazine • For the automatic change of handling tools • Tool magazine...
Open the catalog to page 3
What we do ficonTEC designs and produces automated production equipment for the assembling or testing of components. We are the market leader in the field of equipment for the assembly or test of micro-optics or opto-electronics such as laser diode manufacture, medical technology, security and military engineering, as well as telecommunications. Contact us EUROPE ficonTEC Service GmbH, Rehland 8, 28832 Achim, Germany Phone: +49 4202 51160-0, Fax: +49 4202 51160-090 Mail: [email protected] USA ficonTEC (USA) Corporation, 25 Calle Canela, San Clemente, CA 92673, USA Phone: +1 949 388-5800, Fax:...
Open the catalog to page 4
