BL500-COS
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Chip on Submount Die Bonder micro assembly machines

Chip on Submount Die Bonder This ficonTEC machine is focused on fully automated bonding processes in the micron and even submicron range. The ficonTEC BL500-COS offers a cost-effective solution and production capabilities for bonding chips on submounts (COS) or to different types of substrates such as Silicon Photonic devices. High Precision Die Bonding ficonTEC‘s BL500-COS performs to the hightest accuracy of +/- 0.5 µm depending on the alignment mechanism and component quality. The bonding is done using laser soldering technology which allows the bonding of multiple chips to one substrate...

Pick & Place • Linear motor driven robot head • Easy tool exchange for different component sizes • Auto calibration after tool exchange • Component flipping capability (optional) • Selective laser soldering system • Post bond measurement capability due to integrated metrology function • Laser Class 1 system • Fully automatic • Cycetime down to 20 sec per device • Up to 8 hours of operation without operator intervention • Customization for different device types possible Bond Head • Easy to change tool shaft • Super ridged design to prevent movement during bond process • Precise bond force...

What we do ficonTEC designs and produces automated production equipment for the assembling or testing of components. We are the market leader in the field of equipment for the assembly or test of micro-optics or opto-electronics such as laser diode manufacture, medical technology, security and military engineering, as well as telecommunications. Contact us EUROPE ficonTEC Service GmbH, Rehland 8, 28832 Achim, Germany Phone: +49 4202 51160-0, Fax: +49 4202 51160-090 Mail: info@ficontec.com USA ficonTEC (USA) Corporation, 25 Calle Canela, San Clemente, CA 92673, USA Phone: +1 949 388-5800,...