- Catalogs
- ficonTEC Service GmbH
- BL500-COS
BL500-COS
BL500-COS
- Remote service and control via the internet.
- Freely programmable machine processes with a user-friendly interface.
- Line-based process programming and recipe-based management of process parameters.
- Active assembly algorithms and SQL database storage for process parameters and component data.
- Flexible data import/export and component tracking.
- Consistent software across all fi conTEC machines.
- Fast soldering process with fiber-coupled light delivery.
- Operates under Laser Class 1 safety standards.
- Selective laser soldering system with post-bond measurement capability.
- Fully automatic operation with cycle time down to 20 seconds per device.
- Operates up to 8 hours without operator intervention.
- Customizable for different device types.
- Chip on submount compatibility and selective soldering capability.
- Electronically adjustable bond force and process parameter tracking.
- Quick product switching and forming gas supply.
- Optical Characterization Recognition (OCR) for serial number tracking.
- Modular operating software and remote service initiation.
- Linear motor-driven robot head with easy tool exchange.
- Auto calibration and optional component flipping capability.
- Easy tool shaft change with a super rigid design.
- Precise bond force control and logging capabilities.
- Supports various tray types and optional BlueTape table.
- Camera-based alignment with +/- 1 µm capability and optical distance sensor with +/- 0.5 µm capability.
- Steel base with sliding door cover.
- Control system includes PC, displays, keyboard, and trackball.
- Motion control system for linear and rotary motion.
- Europe: fi conTEC Service GmbH, Germany.
- USA: fi conTEC (USA) Corporation, California.
- Asia: fi conTEC Trading (Shanghai) Limited Company, China.
Catalog excerpts
Chip on Submount Die Bonder micro assembly machines
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Chip on Submount Die Bonder This ficonTEC machine is focused on fully automated bonding processes in the micron and even submicron range. The ficonTEC BL500-COS offers a cost-effective solution and production capabilities for bonding chips on submounts (COS) or to different types of substrates such as Silicon Photonic devices. High Precision Die Bonding ficonTEC‘s BL500-COS performs to the hightest accuracy of +/- 0.5 µm depending on the alignment mechanism and component quality. The bonding is done using laser soldering technology which allows the bonding of multiple chips to one substrate without...
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Pick & Place • Linear motor driven robot head • Easy tool exchange for different component sizes • Auto calibration after tool exchange • Component flipping capability (optional) • Selective laser soldering system • Post bond measurement capability due to integrated metrology function • Laser Class 1 system • Fully automatic • Cycetime down to 20 sec per device • Up to 8 hours of operation without operator intervention • Customization for different device types possible Bond Head • Easy to change tool shaft • Super ridged design to prevent movement during bond process • Precise bond force control...
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What we do ficonTEC designs and produces automated production equipment for the assembling or testing of components. We are the market leader in the field of equipment for the assembly or test of micro-optics or opto-electronics such as laser diode manufacture, medical technology, security and military engineering, as well as telecommunications. Contact us EUROPE ficonTEC Service GmbH, Rehland 8, 28832 Achim, Germany Phone: +49 4202 51160-0, Fax: +49 4202 51160-090 Mail: [email protected] USA ficonTEC (USA) Corporation, 25 Calle Canela, San Clemente, CA 92673, USA Phone: +1 949 388-5800, Fax:...
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