BL300
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Small Footprint Eutectic Die Bonder micro assembly machines

Small Footprint Eutectic Die Bonder The machines of ficonTEC’s 300 series are small footprint yet high precision die bonders. They are designed to break down complex assembly processes into standardized recurring sub-processes for low cost of ownership. The BL300 is an automotive eutectic die bonder. It can be equipped with a conventional heating plate or an state of the art laser soldering module. Typical Tasks • Eutectic die soldering • Chip to chip bonding • Chip to substrate soldering • Pick and place • Die sorting Vision guided Pick & Place ProcessControlMaster Powerful Machine and...

Built for Industrial Usage • Rugged steel base production cell • Hardware interlock circuit for save operation • Ergonomic HUI • Integrated air and vac control • Operation console for comfort access of basic machine function • Cabinets for electrics and pneumatics • Laser class 1 • Machine vision guided fully automated alignment and attach • Fully automatic process • Compact footprint • Reduced complexity • Single task operation • Automatic calibration routine • ProcessControlMaster: Extremely powerful and versatile machine software Vacuum Pick-up Tool Module Features Heating Plate Laser...

What we do ficonTEC designs and produces automated production equipment for the assembling or testing of components. We are the market leader in the field of equipment for the assembly or test of micro-optics or opto-electronics such as laser diode manufacture, medical technology, security and defense engineering as well as telecommunications. Contact us EUROPE ficonTEC Service GmbH, Rehland 8, 28832 Achim, Germany Phone: +49 4202 51160-0, Fax: +49 4202 51160-090 Mail: info@ficontec.com USA ficonTEC (USA) Corporation, 25 Calle Canela, San Clemente, CA 92673, USA Phone: +1 949 388-5800, Fax:...