BL100
BL100
The BL100 Table Top Die Bonder is an entry-level die bonder from fi conTEC’s BL series, designed for both lower volume production and R&D purposes. It offers quick results with exceptional placement accuracy, making it suitable for various micro assembly applications.
Fields of Usage
- Eutectic and epoxy die bonding
- Chip sorting
- CoS (Chip on Submount)
- MEMS/MOEMS assembly
- Sensors and optical components assembly
- Medical technology applications
Features
- Semi-automatic manual die bonder
- Programmable motorized Z-stage
- Fine adjustment of X- and Y-stages
- Placement accuracy: +/- 5 microns
- Working area: 300 x 300 mm
- Component length (max): 10 mm
- Substrate size (max): 25 x 25 mm
Available Modules
- Dispenser module
- Heating plates and heated pick-up tools
- Support plate with vacuum
- Height adjustable bond plate
- High force module
- Observation camera
Operation and Usability
The BL100 features an overhead gantry arrangement with an integrated imaging system, providing a large working area with minimal installation space. It includes dual imaging optics and a programmable Z-stage for intuitive operation and reproducible bonding of electronic and opto-electronic components. Additional options like heating plates and dispenser modules enhance its usability.
Certification
fi conTEC Service GmbH is ISO 9001:2008 certified by DNV GL/Hamburg, Germany.
Contact Information
- Europe: fi conTEC Service GmbH, Achim, Germany
- USA: fi conTEC (USA) Corporation, San Clemente, CA, USA
- Asia: fi conTEC Trading (Shanghai) Limited Company, Shanghai, PRC
Catalog excerpts
micro assembly machines
Open the catalog to page 1
Fields of Usage • Eutectic die bonding • Epoxy die bonding • Chip sorting • CoS (Chip on Submount) • MEMS/MOEMS assembly • Sensors assembly • Assembly of optical components (photo diodes, laser diodes) • Assembly of mechanical components • Applications in the field of medical technology Features • Semi automatic manual die bonder • Programmable motorized Z-stage • Fine adjustment of X- and Y-stages • Placement accuracy: +/- 5 microns • Component length (max): 10 mm • Substrate size (max): 25
Open the catalog to page 2
Simple Solutions for best Results The BL100 is a versatile handling system designed for micro assembly applications like die bonding or component handling. The BL100 is an assembling platform utilizing an overhead gantry arrangement with an integrated imaging system. This arrangement provides a maximum working area at minimal installation area. Available Modules • • • • • • • Dispenser module Heating plates Heated pick-up tools Support plate with vacuum Height adjustable bond plate High force module Observation camera Vacuum component gripper GelPak fields Intuitive Operation With the integrated...
Open the catalog to page 3
ficonTEC designs and produces high precision production equipment for the assembling or testing of components. We are the market leader when it comes to automated assembly or test of micro-optics or opto-electronics such as laser diode manufacture, medical technology, security and defense engineering, as well as telecommunication. Contact us EUROPE ficonTEC Service GmbH, Rehland 8, 28832 Achim, Germany Phone: +49 4202 51160-0, Fax: +49 4202 51160-090 Mail: [email protected] USA ficonTEC (USA) Corporation, 25 Calle Canela, San Clemente, CA 92673, USA Phone: +1 949 388-5800, Fax: +1 949 388-1489 Mail:...
Open the catalog to page 4
