AL300
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Small Footprint High Precision Assembly Cell micro assembly machines

Small Footprint High Precision Assembly Cell The machines of ficonTEC‘s 300 series are small footprint yet high precision die bonders. They are designed to break down complex assembly processes into standardized recurring sub-processes for low cost of ownership. Same as fully contained systems such as the 1000 or 2000 series the AL300 is build for industrial usage in production environments. Typical Tasks • Pick and place • Die sorting • Dispensing of adhesives • UV curing • Chip to chip bonding • Chip to package assembly Vision guided Pick & Place ProcessControlMaster Powerful Machine and...

Key Features Built for Industrial Usage Rugged steel base production cell Hardware interlock circuit for save operation Ergonomic HUI Integrated air and vac control Operation console for comfort access of basic machine function • Cabinets for electrics and pneumatics • Laser class 1 (for selected models) • • • • • Compact footprint Simple reconfiguration Reduced complexity Single task operation Fully automatic process Automatic calibration routine ProcessControlMaster: Extremely powerful and versatile machine software Dispensing Unit Vacuum Pick-up Tool • For the dispensing of e.g. epoxies •...

What we do ficonTEC designs and produces high precision production equipment for the assembling or testing of components. We are the market leader when it comes to automated assembly or test of micro-optics or opto-electronics such as laser diode manufacture, medical technology, security and defense engineering, as well as telecommunication. Contact us EUROPE ficonTEC Service GmbH, Rehland 8, 28832 Achim, Germany Phone: +49 4202 51160-0, Fax: +49 4202 51160-090 Mail: info@ficontec.com USA ficonTEC (USA) Corporation, 25 Calle Canela, San Clemente, CA 92673, USA Phone: +1 949 388-5800, Fax: +1...